Embedded Package Substrate Layout for Thin Multifunction Packaging
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Solution Overview
Problem
Consumer electronic and communication products require electronic device packages with superior electrical properties, low power consumption, and compactness, which is challenging due to the increased thickness caused by active and passive components.
Innovation Solution
A package substrate manufacturing method involving a temporary substrate with a cavity and fiducial mark, where an electronic component with a reference alignment mark is aligned and embedded, covered with a dielectric layer and passivation layers, and conductive traces are formed to connect exposed conductive wires, maintaining a thin thickness and enabling multiple functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If active components and passive components are added to achieve multiple functions and high performance, then the functionality and performance are improved, but the overall thickness of the electronic device package increases
Solution Approach 1:
The electronic component is embedded within a cavity formed in the substrate, allowing the component to be nested inside the substrate structure rather than placed on top. This nesting approach enables multiple functions to be integrated while maintaining a thin overall package thickness, as the component occupies internal space rather than adding to the external dimensions.
Solution Approach 2:
The invention transitions from a two-dimensional surface mounting approach to a three-dimensional embedded approach by creating a cavity within the substrate. This dimensional change allows components to be positioned within the substrate volume, enabling high functionality without increasing the planar footprint or overall thickness of the package.
2Manufacturing precision
If alignment marks are formed on the electronic component, then the alignment precision is improved, but the manufacturing complexity increases
Solution Approach 1:
The alignment mark is formed on the electronic component during the component manufacturing process, before the component is mounted or embedded in the substrate. This preliminary formation of the alignment mark simplifies the subsequent embedding process, as the mark is already present and can be directly used for alignment without requiring additional manufacturing steps.
Solution Approach 2:
The electronic component itself provides the alignment mark as an integral feature, eliminating the need for separate alignment mark structures or additional alignment mechanisms. The component's own structure serves the dual purpose of being the functional element and providing the alignment reference, thereby reducing overall manufacturing complexity.
Data Source
AI summary
A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.