Embedded Electronic Package Layout for Warpage and Overheating
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Solution Overview
Problem
Conventional semiconductor packages face issues with warpage and structural weakness due to increased functional demands, leading to broken circuit lines, which are exacerbated by high temperature conditions.
Innovation Solution
The electronic package design includes a circuit board and circuit blocks embedded in an encapsulating layer, with separate current conduction paths, allowing for improved structural strength and preventing overheating by maintaining distance between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the line density of the circuit structure is increased to satisfy high-density contacts, then the structural strength decreases and warpage occurs under high temperature, but if the line width is increased to strengthen structural strength, then the line density decreases and fine line demands cannot be met
Solution Approach 1:
The patent divides the circuit structure into two separate layers: a first circuit structure layer with fine lines for high-density signal transmission, and a second circuit structure layer with thicker lines for power transmission and structural support. This segmentation allows each layer to optimize for its specific function without compromise.
Solution Approach 2:
The patent transitions from a single-plane circuit structure to a multi-layer three-dimensional circuit architecture. By stacking circuit structures on different planes and connecting them through vertical vias, the design achieves both fine line density and structural strength by utilizing the third dimension (vertical stacking).
2Reliability
If the widths of the lines of the circuit structure are increased to strengthen structural strength, then the circuit structure can satisfy high-temperature conditions, but the line density cannot be increased and fine line demands cannot be met
Solution Approach 1:
The patent separates power transmission functions from signal transmission functions into different circuit layers. The second circuit structure layer with thicker lines handles power transmission and provides thermal management, while the first circuit structure layer with fine lines handles high-density signal transmission.
Solution Approach 2:
By creating a multi-layer circuit structure with vertical interconnections, the patent distributes thermal load across multiple layers. The lower power-consuming signal layers are positioned away from the heat-generating components, while the power layer provides thermal pathways, achieving both high line density and high-temperature reliability.
3Adaptability or versatility
If the functional requirements of the semiconductor chip are increased to meet product demands, then the contact density and line density must be increased, but the structural strength decreases leading to warpage and broken lines
Solution Approach 1:
The patent segments the circuit functions into specialized layers: signal transmission layers with fine lines for high-density I/O, power transmission layers with thicker lines for current carrying, and grounding layers for noise reduction. This functional segmentation enables high functionality while maintaining structural integrity.
Solution Approach 2:
The patent employs a composite circuit structure combining different line width specifications, materials, and layer configurations within a single package. This composite approach allows optimization of each layer for its specific function while the overall structure provides the necessary mechanical strength and thermal management.
Data Source
AI summary
An electronic package is provided, in which a circuit board and a circuit block are embedded in an encapsulating layer at a distance to each other, and circuit structures are formed on the two opposite surfaces of the encapsulating layer with electronic components arranged on one of the circuit structures. The circuit block and the circuit board embedded in the encapsulating layer are spaced apart from each other to allow to separate current conduction paths. As such, the circuit board will not overheat, and issues associated with warpage of the circuit board can be eliminated. Moreover, by embedding the circuit block and the circuit board in the encapsulating layer at a distance to each other, the structural strength of the encapsulating layer can be improved.