Embedded Semiconductor Package With Wiring Across Substrate
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Solution Overview
Problem
Existing semiconductor packages fail to meet the requirements of next-generation devices in terms of reliability, compactness, high performance, and cost-effective manufacturing, particularly due to limitations in testing packaged dies before assembly and mismatch in coefficients of thermal expansion between dies and substrates.
Innovation Solution
A semiconductor package embedded in a substrate with a wiring portion extending across the substrate, allowing for pre-testing of dies, multiple dies in a single package, and reduced thermal expansion mismatch, featuring a base substrate with a cavity for the package, insulating material, and conductive connections through bonding pads and metal patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a semiconductor package is embedded in a substrate, then the compactness and integration density are improved, but the manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent performs die testing within the package structure before final substrate assembly, allowing defect detection and elimination to occur prior to integration. This preliminary action simplifies the overall manufacturing process by preventing defective components from complicating subsequent assembly steps.
Solution Approach 2:
The patent embeds the semiconductor package within a cavity in the substrate, creating a nested structure where the package is contained within the substrate volume. This nesting approach improves compactness by utilizing three-dimensional space efficiently while maintaining organized separation between components.
2Productivity
If multiple dies are placed in a single package, then the productivity and integration density are improved, but the manufacturing precision and yield control become more difficult
Solution Approach 1:
The patent tests multiple dies within the package structure before final assembly with the substrate. This preliminary testing allows for yield verification and defect detection at the package level, enabling precision control to be maintained even when multiple dies are integrated in a single package.
3Reliability
If the package is embedded in the substrate, then the thermal expansion mismatch is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent embeds the package within a cavity in the substrate, creating a nested configuration that allows for thermal expansion management. The embedded structure enables better thermal coupling and reduced mismatch between components with different expansion coefficients, while the cavity provides a controlled environment for the integration process.
Data Source
AI summary
A device includes a base substrate, a package including an encapsulated die, the package at least partially embedded in the base substrate, and a wiring portion on the package and extending across at least a portion of the base substrate adjacent to the package.