Embedded Packaging Structure With Bendable Substrate Cavities
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Solution Overview
Problem
Current packaging methods for semiconductor devices, such as Wire Bonding (WB) and Flip chip (FC), struggle to reduce the size of the package in both the X and Y directions, hindering high-density integration and miniaturization due to the tiled attachment of components on a substrate.
Innovation Solution
A manufacturing method for an embedded packaging structure involves processing a metal seed layer to form a substrate with circuit and metal columns, creating cavities, assembling components and a flexible board, and bending the substrate to form an included angle, thereby reducing its size in the X and Y directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If components are attached on a surface of a substrate in a tiled way using current packaging methods, then the substrate can support multiple components, but the size of the package in the X direction and Y direction cannot be effectively reduced
Solution Approach 1:
The patent transitions from two-dimensional tiled attachment on the substrate surface to three-dimensional embedded attachment within substrate cavities. Components are positioned inside cavities formed in the substrate, allowing vertical stacking and embedding rather than only planar arrangement. This dimensional change enables higher component density without increasing the planar footprint of the package.
Solution Approach 2:
The patent implements nesting by placing components inside cavities within the substrate structure. The components are embedded within the substrate volume, similar to nested dolls, where one object is placed inside another. This nested arrangement allows multiple components to occupy the same planar space at different vertical levels, reducing the overall package area while maintaining high component count.
2Area of stationary object
If the substrate is bent to reduce its size in the X and Y directions, then miniaturization is achieved, but the structural integrity and electrical connections must be maintained
Solution Approach 1:
The patent employs a flexible substrate that can be bent without compromising structural integrity. The substrate is designed with appropriate flexibility to allow bending into three-dimensional configurations while maintaining mechanical strength. This flexible nature enables the substrate to be folded or bent to reduce the package footprint while the material properties ensure that structural integrity is preserved during and after bending.
Solution Approach 2:
The patent introduces dynamic flexibility to the substrate, allowing it to change shape from a flat two-dimensional configuration to a bent three-dimensional configuration. The substrate can be dynamically adjusted during the packaging process to achieve the desired compact form factor. This dynamic capability enables the substrate to adapt its shape to minimize package size while maintaining all necessary electrical and mechanical connections.
Data Source
AI summary
An embedded packaging structure and a manufacturing method thereof are disclosed. The method includes: providing a bearing plate with a first metal seed layer; processing on the first metal seed layer to obtain a substrate; removing the bearing plate to obtain the substrate, and processing on the substrate to obtain a first and a second cavities penetrating therethrough; assembling a first component in the first cavity, assembling a connecting flexible board in the second cavity, processing on a second side of the substrate to obtain a second insulating layer; processing on a first side of the substrate to obtain a second circuit layer, assembling a second component on the second circuit layer; bending the substrate through the connecting flexible board to form an included angle less than 180 degrees on the first side, and packaging the first side by using a packaging material to obtain a packaging layer.