Embedded Packaging Structure With Copper Frame Heat Dissipation

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Solution Overview

Problem

Current manufacturing methods for device embedded packaging structures are complex, leading to high manufacturing costs and difficulties in controlling the thickness and uniformity of the dielectric layer, as well as requiring a challenging adhesive layer application, which affects the subsequent wiring and heat dissipation efficiency.

Innovation Solution

A simplified manufacturing method involving lamination of dielectric materials on copper foil, forming feature patterns, etching to create metal frames, applying an adhesive layer, and building up wiring layers without a pre-set adhesive layer, allowing for improved control over the dielectric layer thickness and uniformity, and enhancing heat dissipation by presetting copper foil.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a pre-set adhesive layer is applied at the bottom of the opening frame, then the chip can be attached, but the adhesive layer application becomes difficult and time-consuming, and the amount is difficult to control, resulting in wave fluctuation of the chip in the thickness direction

Engineering Contradiction:

Improvechip attachment stabilityVSAvoidadhesive layer application difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The adhesive layer is applied preliminarily on the entire lower surface of the metal frame before etching the opening frame, rather than applying it precisely at the bottom of the opening frame later. This preliminary action simplifies the application process and makes the amount of adhesive easier to control, while still ensuring proper chip attachment.

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If single-sided layer building-up is used, then the manufacturing process is simpler, but the packaging structure cannot be managed and controlled, and the thickness of the package is thicker

Engineering Contradiction:

Improvemanufacturing process simplicityVSAvoidpackage thickness control

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The layer building-up process is segmented into two sides: a first dielectric layer is formed on the lower surface of the metal frame, and a second dielectric layer is formed on the upper surface. This segmentation allows independent control and management of each layer, enabling precise thickness control while maintaining process simplicity.

Inventive Principle:

Principle #1Segmentation

3Reliability

If traditional packaging structure is used, then the device can be packaged, but the heat dissipation efficiency is insufficient

Engineering Contradiction:

Improvedevice packaging functionalityVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The metal frame is constructed using a composite structure combining a lower metal layer and an upper metal layer, which enhances heat dissipation efficiency compared to traditional single-layer structures. This composite material approach maintains packaging functionality while improving thermal management.

Inventive Principle:

Principle #40Composite materials

4Reliability

If the adhesive layer amount is not controlled, then the chip can be attached, but the wave fluctuation of the chip in the thickness direction affects the subsequent wiring

Engineering Contradiction:

Improvechip attachmentVSAvoidchip position uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The adhesive layer is applied preliminarily on the entire lower surface of the metal frame before etching the opening frame, allowing for uniform distribution and precise control of the adhesive amount. This preliminary application ensures consistent chip positioning without wave fluctuation, enabling subsequent wiring processes.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces manufacturing steps, lowers costs, improves production efficiency, and ensures consistent layer building and heat dissipation by eliminating the need for a pre-set adhesive layer and simplifying the process flow, resulting in a more efficient and cost-effective packaging structure.

Implementation Method 1

presetting the copper foil in the dielectric layer to form a metal frame, which improves the heat dissipation efficiency

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

applying an adhesive layer on the bottom surface of the metal frame, and mounting a device on the adhesive layer

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20240063055A1Manufacturing method for device embedded packaging structure

Publication Date: 2024.02.22 ZHUHAI ACCESS SEMICONDUCTOR CO LTD

AI summary

A method for manufacturing a device embedded packaging structure include laminating a first dielectric material on a copper foil to form a first dielectric layer, and forming a first feature pattern in the first dielectric layer to expose the copper foil, etching the exposed copper foil to form a device opening frame and a via post opening frame to obtain a metal frame, applying an adhesive layer on the metal frame, and mounting a device to the adhesive layer in the device opening frame, laminating a second dielectric material to form a second dielectric layer covering the metal frame and filling the device opening frame and the via post opening frame, forming a via post in the via post opening frame, and forming a first wiring layer and a second wiring layer conductively connected by the via post on the upper and lower surfaces of the second dielectric layer.