Embedded Packaging Heat Dissipation via Copper Pillars

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Solution Overview

Problem

Existing embedded packaging technologies face limitations in heat dissipation area, production cost, and production time due to single-sided heat dissipation methods and the use of processes like laser drilling or plasma etching.

Innovation Solution

An embedded packaging method that involves a frame with through holes and copper pillars, where photosensitive insulating material is used to increase the heat dissipation area by forming multiple circuit layers through electroplating and etching, allowing for multi-directional heat dissipation and reducing production costs and time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If single-sided heat dissipation packaging method is used, then production process is simple, but heat dissipation area is limited

Engineering Contradiction:

Improvepackaging process complexityVSAvoidheat dissipation area

Core Design Contradiction:

Device complexityVSArea of stationary object

Solution Approach 1:

The patent transitions from single-sided heat dissipation to multi-directional heat dissipation by forming copper pillars on both the front and back surfaces of the substrate, utilizing the third dimension (depth/through-hole direction) to expand heat dissipation pathways. This allows heat to be conducted through multiple routes simultaneously, significantly increasing the effective heat dissipation area without proportionally increasing process complexity.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Temperature

If laser drilling or plasma etching is used to form through holes, then heat dissipation can be achieved, but production cost increases and production period extends

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidproduction efficiency

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The patent replaces expensive and time-consuming laser drilling or plasma etching processes with a more economical mechanical drilling method combined with simple chemical etching. This substitution uses lower-cost equipment and materials while achieving the same functional result of creating through-holes for copper pillar formation, thereby reducing both production cost and production time.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent replaces advanced mechanical processes (laser drilling, plasma etching) with simpler mechanical drilling followed by chemical etching. This substitution reduces equipment requirements and process complexity while maintaining the ability to create precise through-holes for embedded copper pillars, improving productivity without sacrificing heat dissipation performance.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances heat dissipation efficiency, reduces production costs, and shortens the production period by increasing the heat dissipation area and simplifying the packaging process compared to conventional single-sided methods.

Implementation Method 1

curing photosensitive insulating material in a partial space of the through hole to expose a upper surface of the device

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Implementation Method 2

electroplating on the first surface to form a first metal layer, and electroplating on the upper surface and side surface of the device

Methodology Applied

Scientific EffectElectroplating: Electroplating

Implementation Method 3

electroplating on the upper surface and side surface of the device, an upper surface of the photosensitive insulating material and an upper end face of each of the first copper pillars to form a second metal layer

Methodology Applied

Scientific EffectElectrochemical reduction: Electrodeposition

Data Source

PatentUS11114310B1Embedded packaging method capable of realizing heat dissipation

Publication Date: 2021.09.07 ZHUHAI ACCESS SEMICONDUCTOR CO LTD

AI summary

An embedded packaging method capable of realizing heat dissipation, includes: providing a frame having at least one through hole; attaching a tape on the first surface and placing a device in the through hole; completely filling the through hole with photosensitive insulating material, and completely curing the photosensitive insulating material in a lower portion of the through hole while not completely curing the photosensitive insulating material in an upper portion of the through hole and covered on the second surface; electroplating on the first surface to form a first metal layer, and electroplating on the upper surface and a side surface of the device, an upper surface of the photosensitive insulating material and an upper end face of each of the first copper pillars to form a second metal layer; and etching to obtain a first circuit layer and a second circuit layer, respectively.