Silicon-Ceramic Embedded Packaging for Heat and Moisture Resistance
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Solution Overview
Problem
Existing embedded component packaging (ECP) technologies using resin substrates suffer from poor thermal conductivity, leading to inefficient heat dissipation, high water absorption, and weakened bonding forces, which can result in delamination and short circuits, especially in high temperature and high humidity environments.
Innovation Solution
The proposed solution involves an embedded packaging structure with a substrate frame made of silicon or ceramic, featuring through holes for a metal connection electrode and an embedded electronic component. This design enhances heat dissipation, moisture resistance, and structural strength, eliminating the need for an insulation medium layer between the interconnection line layers and the substrate frame, thereby reducing thickness and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin material is used for substrate frame, then ease of manufacture is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The patent changes the material parameter of the substrate frame from resin to silicon or ceramic, which fundamentally alters the thermal conductivity parameter. Silicon and ceramic materials have inherently higher thermal conductivity than resin, enabling effective heat dissipation while maintaining manufacturability through established semiconductor and ceramic processing techniques.
Solution Approach 2:
The patent employs composite material structure by combining silicon or ceramic substrate frame with metal connection electrodes and insulation medium layers. This composite approach leverages the high thermal conductivity of silicon/ceramic for heat dissipation while integrating metal for electrical connection and insulation layers for electrical isolation, achieving multiple functional requirements simultaneously.
2Ease of manufacture
If resin material is used for substrate frame, then ease of manufacture is improved, but moisture resistance deteriorates
Solution Approach 1:
The patent changes the material composition parameter from hydrophilic resin to hydrophobic silicon or ceramic materials. These materials have inherently low water absorption rates and high moisture resistance, eliminating the delamination and ion migration problems associated with resin materials in high humidity environments.
3Ease of manufacture
If resin material is used for substrate frame, then ease of manufacture is improved, but bonding strength deteriorates
Solution Approach 1:
The patent changes the material parameter from resin to silicon or ceramic, which fundamentally improves the bonding strength parameter. Silicon and ceramic substrates provide superior mechanical adhesion for metal connection electrodes and embedded components, preventing delamination under thermal and mechanical stress.
4Reliability
If insulation medium layer is added between interconnection line layers and substrate frame, then electrical insulation is improved, but device complexity increases
Solution Approach 1:
The patent merges the substrate frame function with the insulation function by making the substrate frame itself (silicon or ceramic) electrically insulating or by integrating the insulation medium layer directly into the substrate structure. This eliminates the need for separate insulation medium layers, reducing device complexity while maintaining electrical insulation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved packaging structure achieves better heat dissipation performance, enhanced moisture resistance, and increased structural strength, leading to improved reliability and electrical characteristics of ECP products.
Implementation Method 1
the substrate frame in this application has better heat dissipation performance
Implementation Method 2
the substrate frame in this application has better heat dissipation performance, moisture resistance, and strength
Data Source
AI summary
This application provides an embedded packaging structure, a preparation method thereof, and a terminal device. The embedded packaging structure includes a substrate frame, and a first through hole and a second through hole that run through the substrate frame in a thickness direction of the substrate frame. A metal connection electrode is disposed in the first through hole, an electronic component is embedded in the second through hole, and a pin of the electronic component is exposed at a hole opening of the second through hole. The substrate frame is made of silicon or a ceramic. Compared with a prior art substrate frame formed by using a resin material, the substrate frame in this application has better heat dissipation performance, moisture resistance, and strength in addition to providing insulation.