Embedded Packaging Shielding Cavity for Electromagnetic Interference
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Solution Overview
Problem
Traditional electronic device packaging lacks effective electromagnetic shielding, particularly in embedded products, as metal shells only protect from five sides, leaving the pins and signal transmission paths vulnerable to interference, which can cause device damage and efficiency loss.
Innovation Solution
An embedded package structure with a shielding cavity is developed, featuring a Cu pillar shielding wall on all six sides, grounded for complete electromagnetic shielding, and a manufacturing method involving multiple polymer dielectric layers and wiring layers to enclose the device and protect signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shell is added outside the package to shield electromagnetic radiation, then electromagnetic shielding capability is improved, but the shielding is incomplete as it only covers five sides and leaves the pin side vulnerable
Solution Approach 1:
The shielding structure is divided into multiple segments: a metal shell covering five sides and a separate shielding layer formed on the pin side through wiring layers and grounding. This segmentation allows each part to be optimized independently while achieving complete coverage.
Solution Approach 2:
The shielding approach transitions from a simple external metal shell to a multi-dimensional solution that includes internal wiring layers, grounding structures, and a combination of external and internal shielding elements to cover all six sides comprehensively.
2Ease of manufacture
If pins are welded onto the motherboard by solder balls without additional shielding, then manufacturing simplicity is maintained, but the signal transmission path remains vulnerable to electromagnetic interference
Solution Approach 1:
The shielding function is merged with the existing wiring layers and grounding structures. The wiring layers are configured to provide shielding for the signal transmission path from pins to the device, combining structural support and electromagnetic protection functions.
Solution Approach 2:
The wiring layers act as an intermediary shielding element between the pins and the motherboard, providing electromagnetic protection while maintaining the existing solder ball connection method. Grounding structures serve as intermediaries to channel interference away from sensitive signal paths.
3Volume of stationary object
If the device is exposed without complete shielding, then package volume is reduced, but electromagnetic interference can cause device damage and energy loss
Solution Approach 1:
The metal shell and wiring layers serve multiple functions: they provide electromagnetic shielding, structural support, and thermal management. This multi-functionality reduces the need for separate dedicated shielding components, thereby minimizing additional volume.
Solution Approach 2:
The shielding structure utilizes thin metal shell and wiring layers that provide effective electromagnetic protection with minimal thickness. These thin-film shielding elements enclose the device while adding minimal volume to the overall package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides comprehensive electromagnetic shielding, reducing device damage, improving integration, and minimizing energy loss by enclosing the device in a nearly complete shielding cavity, thus enhancing the device's operational efficiency and reliability.
Implementation Method 1
a shielding cavity enclosing the device, wherein the shielding cavity is defined by a shielding wall embedded in the insulating layer and surrounding the device on four sides
Implementation Method 2
first and second wiring layers which cover first and second end faces of the shielding wall and are electrically connected with the shielding wall
Data Source
AI summary
An embedded package structure having a shielding cavity according to an embodiment of the present disclosure includes a device embedded in an insulating layer, and a shielding cavity enclosing the device, wherein the shielding cavity is defined by a shielding wall embedded in the insulating layer and surrounding the device on four sides, and first and second wiring layers which cover first and second end faces of the shielding wall and are electrically connected with the shielding wall; wherein a signal line leading-out opening is to formed between the first end face of the shielding wall and the first wiring layer, and a signal line connected with a terminal of the device is led, from the signal line leading-out opening, out of the shielding cavity.