Embedded Pad IC Packaging on Dielectric Core
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Solution Overview
Problem
The challenge in integrated circuit packaging is to create smaller, thinner, and more reliable components for portable devices while maintaining low costs and high performance, as existing solutions have not effectively addressed the need for miniaturization and increased packaging density.
Innovation Solution
The method involves forming a dielectric core with an embedded pad, applying a top solder resist layer, and mounting an integrated circuit device with an interconnect pillar to the dielectric core, which prevents bump bridging and ensures reliable connections through the use of a dielectric material that confines the device interconnect, allowing for finer pitch and reduced space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional packaging configurations are used, then manufacturing is easier, but packaging dimensions cannot be reduced sufficiently
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional stacked packaging, where multiple IC devices are vertically arranged on a single substrate. This vertical stacking approach reduces the horizontal footprint and overall packaging dimensions while maintaining manufacturing feasibility through standardized interconnection processes.
Solution Approach 2:
The patent implements nested packaging by placing multiple IC devices within a compact three-dimensional structure on a single substrate. Devices are arranged in stacked configurations where smaller components are positioned within the vertical space occupied by larger components, maximizing space utilization and reducing overall packaging volume.
2Quantity of substance
If packaging density is increased, then more components fit in smaller space, but reliability decreases due to potential electrical shorting
Solution Approach 1:
The patent introduces a dielectric material as an intermediary substance between adjacent conductive interconnect structures. This dielectric layer acts as an electrical insulator that prevents shorting between closely spaced interconnects, enabling higher packaging density while maintaining connection reliability through proper electrical isolation.
Solution Approach 2:
The patent applies different material properties to different regions of the packaging structure. Conductive materials are used for interconnect paths where electrical connection is needed, while dielectric materials are applied in regions where electrical isolation is required. This spatial differentiation of material properties enables both high density and high reliability.
3Area of moving object
If pitch size is reduced for miniaturization, then packaging density increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the packaging structure into modular layers and standardized interconnection units. By segmenting the design into repeatable building blocks with defined pitch relationships, the manufacturing process can use standardized alignment procedures rather than requiring custom precision for each unique configuration, making smaller pitches more manufacturable.
Data Source
AI summary
An integrated circuit packaging system and method of manufacture thereof includes: a dielectric core having an embedded pad; a top solder resist layer on the dielectric core, a pad top surface of the embedded pad below the top solder resist layer; a device interconnect attached to the embedded pad; and an integrated circuit device having an interconnect pillar, the interconnect pillar attached to the device interconnect for mounting the integrated circuit device to the dielectric core.