Embedded Passive Component Board Design for Parasitic Inductance Reduction
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Solution Overview
Problem
High-performance electronic packages face challenges in reducing parasitic inductance and impedance due to the distance between semiconductor chips and passive components, leading to power noise and integrity issues, while embedding passive components in existing structures results in defects like voids and undulations.
Innovation Solution
A board design with an embedded passive component, featuring a core structure with through-holes for passive component placement, covered by insulating layers and additional core and build-up layers for rigidity and uniform insulation, allowing for coplanar surfaces and reduced thickness differences, thereby minimizing defects and enhancing electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If passive components are disposed around semiconductor or adjacent to solder ball (DSC/LSC configuration), then distance between capacitor and semiconductor is decreased, but parasitic inductance is still caused due to several to several tens of millimeters distance
Solution Approach 1:
The patent merges the passive component embedding process with the core layer formation process. The passive components are embedded within the core structure itself during the lamination of core layers and insulating layers, rather than being disposed separately on the board surface. This integration reduces the distance to sub-millimeter levels and eliminates parasitic inductance by making the passive components part of the fundamental board structure.
Solution Approach 2:
The patent embeds passive components within nested layers of insulating material and core layers. The passive components are surrounded and enclosed by the insulating layers and core layers, creating a nested structure where the passive component is embedded at a predetermined depth within the core structure, achieving minimal distance and reduced parasitic inductance.
2Length of moving object
If passive components are embedded in existing board structures, then distance is reduced, but defects such as void or undulation occur
Solution Approach 1:
The patent performs preliminary actions by forming the insulating layers and embedding the passive components before completing the core structure. The insulating layers are applied to cover the passive components at a predetermined depth, and subsequent core layers are laminated over this prepared structure. This preliminary embedding and insulation approach prevents voids and undulations by establishing a stable foundation before finalizing the core structure.
Solution Approach 2:
The patent applies local quality by providing different structural characteristics at different locations and depths. The passive components are embedded at a specific depth within the core structure, surrounded by insulating layers with specific material properties. This localized embedding with tailored insulating material properties ensures proper encapsulation without causing defects, while maintaining overall structural integrity.
3Adaptability or versatility
If multiple passive components with different thicknesses are embedded, then design flexibility is improved, but via processing and plating quality deteriorates
Solution Approach 1:
The patent solves the thickness variation problem by transitioning to a three-dimensional embedding approach. Instead of embedding all passive components at the same surface level, the invention embeds them at different predetermined depths within the core structure. This depth dimension allows passive components of different thicknesses to be properly accommodated while maintaining consistent via processing and plating quality, as the insulating layers are applied to cover each component at its specific embedding depth.
Data Source
AI summary
A board includes: a core structure; one or more first passive components embedded in the core structure; a first build-up structure disposed on one side of the core structure and including first build-up layers and first wiring layers; and a second build-up structure disposed on the other side of the core structure and including second build-up layers and second wiring layers. One surface of a first core layer contacting a first insulating layer is coplanar with one surface of each of the one or more first passive components contacting a first insulating layer, the other surface of each of the one or more first passive components covered with a second insulating layer is spaced apart from a second core layer, and the one or more first passive components are electrically connected to at least one of the plurality of first wiring layers and the plurality of second wiring layers.