Embedded Passive Component Multi-Layer Circuit Board Manufacturing
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Solution Overview
Problem
The existing manufacturing processes for multi-layer circuit boards with embedded passive components face challenges in maintaining electrical precision while simplifying the process, particularly in controlling the printing area of resistors and capacitors to avoid variations from designed values.
Innovation Solution
A method involving a single layer plate with a dielectric layer and a conductive foil, where the dielectric layer is heated and a passive component is pressed into it, followed by stacking on a core substrate and forming electrical patterns on conductive foils, allowing for electrical connection through holes and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the printing area of the resistor is carefully controlled to maintain electrical precision, then the electrical precision is improved, but the manufacturing process becomes more complicated
Solution Approach 1:
The patent extracts the passive component manufacturing process from the circuit board manufacturing process. By using a separate substrate where passive components are formed independently through deposition and patterning, then transferring them to the circuit board, the complex printing area control requirements are eliminated while maintaining electrical precision
Solution Approach 2:
The patent segments the manufacturing process into two independent parts: (1) forming passive components on a separate substrate, and (2) transferring them to the circuit board. This segmentation allows each process to be optimized independently, maintaining precision without increasing overall process complexity
2Manufacturing precision
If the printing area of the resistor is carefully controlled to maintain electrical precision, then the electrical precision is improved, but the manufacturing process time increases
Solution Approach 1:
The patent performs preliminary action by forming all passive components on a separate substrate before the circuit board manufacturing. This allows parallel processing where passive components are prepared in advance, eliminating the need for time-consuming printing area control during the main manufacturing process
3Area of stationary object
If passive components are embedded in the circuit board, then the space utilization is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the passive component substrate with the circuit board through lamination, achieving space utilization improvement by embedding components while keeping the manufacturing process relatively simple through standardized joining processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity and enhances electrical precision by embedding passive components without requiring precise control over printing sizes, enabling the formation of multi-layer circuit boards with improved accuracy and reduced costs.
Implementation Method 1
heating the single layer plate to melt the dielectric layer
Data Source
AI summary
A manufacturing method of a multi-layer circuit board with an embedded passive component includes providing a single layer plate having a dielectric layer and a first conductive foil, heating the single layer plate to melt the dielectric layer, pressing a passive component into the second surface of melting dielectric layer, stacking the single layer plate on a core substrate, stacking a second conductive foil on single layer plate, and forming electrical pattern on the second conductive foil. The dielectric layer has a first surface and a second surface. The first conductive foil is disposed on the first surface.