Embedded Passive Device Semiconductor Package with Metallic Line Electrode

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Solution Overview

Problem

During semiconductor chip packaging, physical shocks from wire bonding can damage passive devices like capacitors, and high-frequency or high-power applications experience signal distortion due to the limitations of existing packaging methods.

Innovation Solution

A semiconductor package design that incorporates a metallic line as the upper electrode for the passive device, eliminating the need for a separate functional electrode and using a cover layer with openings to form the electrode pattern, which reduces the risk of damage and allows for efficient signal transmission without wire bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wire bonding is used to electrically connect the semiconductor chip to the capacitor, then electrical connection is achieved, but physical shocks are applied to the capacitor causing damage to the insulator or upper electrode

Engineering Contradiction:

Improveintegrity of passive deviceVSAvoidphysical shock from wire bonding

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent merges the electrical connection function with the upper electrode structure by forming the metallic line and upper electrode simultaneously as a single integrated structure. This eliminates the need for separate wire bonding that causes physical shocks, while maintaining electrical connectivity between the semiconductor chip and passive device.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the wire bonding process from the manufacturing sequence by directly forming the metallic line as part of the electrode structure during the electrode formation process. This removes the harmful wire bonding step that applies physical shocks to the passive device while preserving the essential electrical connection function.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If wire bonding is used for high-frequency or high-power applications, then electrical connection is established, but signal distortion occurs

Engineering Contradiction:

Improvesignal integrityVSAvoidsignal distortion

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent combines the signal transmission path with the electrode structure by forming the metallic line and upper electrode as an integrated structure. This direct integration eliminates the signal path disruptions caused by wire bonding, thereby reducing signal distortion in high-frequency and high-power applications.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent replaces the mechanical wire bonding system with a direct metallic line formation process. This substitution eliminates the mechanical connections that cause signal distortion, providing a more stable and reliable electrical connection for high-frequency and high-power signal transmission.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If a separate upper electrode is formed for the passive device, then the passive device functions correctly, but manufacturing cost increases and defects occur

Engineering Contradiction:

Improvefunctionality of passive deviceVSAvoidmanufacturing cost and defect rate

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the upper electrode formation with the metallic line formation process, creating both structures simultaneously in a single manufacturing step. This integration eliminates the need for separate electrode formation processes, reducing manufacturing complexity, cost, and the risk of defects associated with multiple processing steps.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The metallic line structure serves multiple functions simultaneously: it provides electrical connection between components and acts as the upper electrode for the passive device. This multi-functionality eliminates the need for separate dedicated electrode structures, simplifying manufacturing and reducing costs while ensuring proper passive device functionality.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS11538770B2Semiconductor package including passive device embedded therein and method of manufacturing the same

Publication Date: 2022.12.27 KOREA ELECTRONICS TECH INST

AI summary

A semiconductor package includes a semiconductor chip including an electrode pad formed on the top surface thereof, a passive device embedded in the semiconductor package, the passive device having no functional electrode on the top surface thereof, a cover layer covering the semiconductor chip and the passive device, and at least one electrode pattern formed on the cover layer to transmit electrical signals. The cover layer includes at least one first opening formed to expose a region in which the functional electrode is to be formed. The electrode pattern includes a functional electrode portion formed in a region in which the functional electrode of the passive device is to be formed through the first opening. In the process of forming the electrode pattern, a functional electrode of the passive device is formed together therewith, thereby eliminating a separate step of manufacturing a functional electrode and thus reducing manufacturing costs.