Embedded Passive Elements in Packaging Substrates
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Solution Overview
Problem
The existing packaging substrates with passive elements have increased height, leading to electrical signal loss and limited area for circuit layout, making it difficult to incorporate multiple passive elements, which is detrimental for compact electronic devices.
Innovation Solution
A packaging substrate design where passive elements are embedded within a dielectric layer unit, with electrode pads on both surfaces and conductive vias connecting them to circuit layers, reducing structural height and signal transmission distance, allowing for more passive elements to be integrated without area constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If passive elements are disposed on the external surface of the substrate, then the substrate can accommodate passive elements, but the structural height increases and the signal transmission route becomes very long
Solution Approach 1:
The patent embeds passive elements within the substrate structure by nesting them inside the dielectric layer. The passive elements are positioned within recesses or cavities formed in the dielectric layer, allowing them to be integrated into the substrate rather than mounted on the surface. This nesting approach reduces the overall structural height and shortens the signal transmission route between the passive elements and the circuit layers.
2Quantity of substance
If passive elements are disposed on the external surface of the substrate, then passive elements can be installed, but the area for circuit layout is very limited
Solution Approach 1:
The patent transitions from a two-dimensional surface mounting approach to a three-dimensional embedded structure. By incorporating passive elements within the substrate volume rather than on the surface, the design utilizes the third dimension (depth) to accommodate additional components. This dimensional change allows the circuit layout area on the surface to remain fully available while still incorporating multiple passive elements within the substrate structure.
3Reliability
If passive elements are disposed on the substrate, then electrical loop controlling functions are provided, but the structural height increases which is adverse for thinning design
Solution Approach 1:
The patent merges the passive elements with the substrate structure by embedding them within the dielectric layer. The passive elements are integrated into the substrate rather than being separate surface-mounted components, creating a unified structure. This merging approach maintains the electrical loop controlling functions while reducing the overall structural height, as the passive elements are positioned within the substrate thickness rather than adding to it.
Data Source
AI summary
A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in the dielectric layer unit and corresponding to the positioning pad; a first circuit layer disposed on the top surface of the dielectric layer unit, the first circuit layer having first conductive vias electrically connected to the electrode pads disposed on the upper surface of the passive element; and a second circuit layer disposed on the bottom surface of the dielectric layer unit, the second circuit layer having second conductive vias electrically connected to the electrode pads disposed on the lower surface of the passive element. Through the embedding of the passive element, the overall structure may have a reduced height.