Embedded Passive Heat Pipes for Simpler Electronics Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat transfer systems for electronic assemblies face challenges such as thermal conductivity degradation over time, inferior through-plane conductivity, corrosion issues, and complexity due to the use of active heat pipes and clamps.
Innovation Solution
The solution involves a thermally enhanced electronics module design that includes a heat sink body with integrated passive heat pipes, which are concealed within the heat sink body and removably fastened, providing efficient thermal transport without the need for complex geometries or clamps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If annealed pyrolytic graphite (APG) is used for heat transfer, then in-plane thermal conductivity is high (800-1000 W/m-K at EOL), but through-plane conductivity is much lower due to orthotropic structure
Solution Approach 1:
The patent changes the thermal conduction mechanism from relying on orthotropic graphite structure to using isotropic heat pipe vapor space for thermal transport. The heat pipe's vapor space provides uniform thermal conductivity in all directions, eliminating the orthotropic limitation of APG while maintaining high thermal performance.
2Temperature
If active heat pipe designs are used, then heat transport efficiency is improved, but device complexity and integration difficulty increase due to clamps and deformation risks
Solution Approach 1:
The patent extracts the complex clamp and active control mechanisms from the heat pipe system, retaining only the passive heat pipe core functionality. The heat pipe is integrated directly into the PCB trace pattern without requiring external clamps or active control, simplifying the overall device structure while maintaining effective heat transport.
Solution Approach 2:
The patent merges the heat pipe structure with the PCB trace pattern, creating an integrated thermal management solution. The heat pipe traces are formed directly on the PCB substrate, combining the structural and thermal management functions into a single integrated component, eliminating the need for separate heat sinks and mounting hardware.
3Temperature
If heat pipes are exposed to elements for active cooling, then heat dissipation is effective, but corrosion resistance and reliability deteriorate
Solution Approach 1:
The patent nests the heat pipe structure within the PCB trace pattern and encloses it with the PCB substrate and conformal coating. This nested configuration protects the heat pipe from environmental exposure while maintaining thermal efficiency, as the heat pipe operates passively within the protected PCB structure rather than being exposed to external elements.
4Temperature
If composite structures with APG embedded in metallic skins are used, then thermal spreading is improved, but manufacturing complexity and integration difficulty increase
Solution Approach 1:
The patent merges the thermal spreading function directly into the PCB trace pattern formation process. The heat pipe traces are created during standard PCB manufacturing, eliminating the need for separate composite structure assembly. This integration maintains effective thermal spreading while using conventional PCB manufacturing techniques rather than complex composite fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances thermal transport, reduces thermal gradients, and improves the reliability of electronic assemblies by concealing heat pipes within the heat sink body, thus avoiding issues like corrosion and complexity, while maintaining a lightweight and efficient thermal management system.
Implementation Method 1
efficient thermal transport while minimizing weight and complexity
Implementation Method 2
elongate, passive, heat pipe extending within each heat pipe receiving passageway
Implementation Method 3
heat sink body mounted to the printed circuit substrate
Implementation Method 4
heat sink body having opposing ends and opposing side edges extending between the opposing ends
Data Source
AI summary
An electronic assembly may include a chassis, and electronic modules mounted within the chassis. Each electronic module may include a printed circuit substrate, heat-generating electronic components mounted on the printed circuit substrate, and a heat sink body mounted to the printed circuit substrate and having a plurality of heat pipe receiving passageways extending between opposing side edges and overlying corresponding heat-generating components. A respective elongate, passive, heat pipe may extend within each heat pipe receiving passageway and be removably fastened to at least one end to the heat sink body for enhanced conductive heat transport.