Embedded Passive Devices in IC Packaging for Density
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Solution Overview
Problem
The challenge in the computer industry is to achieve miniaturization, increased packaging density, and reduced costs for integrated circuits while maintaining performance, particularly in portable devices, where existing technologies have not adequately addressed integration and cost reduction.
Innovation Solution
The method involves forming an embedding material on a passive device, depositing a dry film layer, patterning it to create a buried pattern electrically connected to the device, and mounting an integrated circuit die on this pattern, which includes a patterned dielectric to enhance routing flexibility and reduce manufacturing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are stacked into a single package to increase packaging density, then packaging density is improved, but device size and thickness cannot be sufficiently reduced
Solution Approach 1:
The patent transitions from vertical stacking (3D stacking) to lateral embedding (2D integration) by placing passive devices within the substrate plane. Multiple passive devices are embedded side-by-side in the same substrate layer rather than stacked vertically, enabling increased component density without increasing package height or overall device volume.
Solution Approach 2:
Passive devices are nested within the substrate structure itself, embedded in recesses or cavities formed in the substrate material. This nesting approach allows passive components to occupy space within the substrate volume rather than requiring additional external package volume, effectively increasing integration density without proportionally increasing device size.
2Adaptability or versatility
If more functions are integrated into each integrated circuit to increase functionality, then functional integration is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges passive devices with the substrate structure by embedding them directly into the substrate during the substrate fabrication process rather than as separate assembly steps. The passive devices are formed using the same semiconductor manufacturing processes (photolithography, etching, deposition) as the substrate, consolidating multiple fabrication steps into a unified manufacturing flow that reduces complexity.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it acts as the mechanical support structure, the electrical interconnection medium, and the embedding matrix for passive devices. This multi-functionality eliminates the need for separate package substrates, interconnect layers, and passive device mounting structures, thereby reducing overall manufacturing complexity while achieving high functional integration.
3Length of moving object
If miniaturization is pursued to reduce device size, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
Passive devices are embedded into the substrate during the substrate fabrication process itself, before final packaging and assembly steps. The embedding is performed using standard photolithography and etching processes at the appropriate fabrication stage, allowing precise positioning and integration to be achieved using established manufacturing precision capabilities rather than requiring additional high-precision assembly operations.
Data Source
AI summary
An integrated circuit packaging system, and a method of manufacture of an integrated circuit packaging system thereof, including: an embedding material on a component; a mask layer on the embedding material; a buried pattern in the mask layer, the outer surface of the buried pattern coplanar with the outer surface of the mask layer, the buried pattern electrically connected to the component; a patterned dielectric on a portion of the buried pattern; and an integrated circuit die on the buried pattern.