Embedded Passive Components in Semiconductor Memory Modules
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Solution Overview
Problem
Conventional semiconductor memory modules suffer from damage and increased height due to exposed passive components like resistors and capacitors during manual insertion, leading to defects and size inefficiencies.
Innovation Solution
The passive components are mounted within the semiconductor package, encapsulated within the mounting substrate, preventing direct contact and damage during handling, and reducing the overall height of the memory module by eliminating the need for separate mounting areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components (resistor and capacitor) are placed outside the semiconductor package, then they can be easily accessed and installed, but they become exposed to damage and abrasion during manual insertion
Solution Approach 1:
The passive components are nested within the semiconductor package structure, specifically placed in the cavity formed by the mounting substrate and cover. This nesting approach allows the components to be protected by the package enclosure while still being accessible for installation through openings in the substrate, thereby resolving the contradiction between ease of installation and damage resistance.
Solution Approach 2:
The mounting substrate acts as an intermediary structure that provides openings for passive component installation while the cover encloses and protects these components. This intermediary structure allows external access to components through controlled openings while the main body of the components remains protected within the package, resolving the contradiction between accessibility and protection.
2Ease of manufacture
If passive components are placed between the tab forming side end and the semiconductor package, then they can be installed, but the overall height of the memory module increases
Solution Approach 1:
Instead of placing passive components in the vertical direction (between tab end and package), the invention relocates them to the horizontal plane within the package cavity. This dimensional change from vertical stacking to horizontal integration allows component installation without increasing module height, resolving the contradiction between installation capability and compact form factor.
Solution Approach 2:
The passive components are merged into the semiconductor package structure itself, sharing the same space and enclosure. By combining the passive component housing with the semiconductor package enclosure, the design eliminates the need for separate external mounting areas, thereby reducing overall module height while maintaining installation capability.
3Ease of operation
If passive components are exposed to the outside, then they are accessible for installation, but they are easily abraded and damaged via contact with the operator
Solution Approach 1:
The passive components are nested within the protected cavity of the semiconductor package, with only necessary portions accessible through controlled openings. This nesting provides physical protection against operator contact while maintaining accessibility for installation, resolving the contradiction between ease of operation and protection from harmful factors.
Solution Approach 2:
The cover structure acts as a protective shell that encloses the passive components. This shell provides a barrier against operator contact and potential damage while allowing controlled access through openings in the mounting substrate, thereby resolving the contradiction between accessibility and protection from mechanical damage.
Data Source
AI summary
Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.