Embedded Passive Substrate Bonding for Compact Voltage Regulators
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Solution Overview
Problem
As electronic systems become more complex and smaller in size, it is challenging to reduce the size of passive devices such as inductors and capacitors while maintaining their electrical properties, particularly inductance, to increase circuit density.
Innovation Solution
The integration of prefabricated discrete passive components within the substrate core, utilizing cavity sidewall connections and hybrid bonding techniques, allows for the embedding of high magnetic permeability inductors and capacitors, providing electrical continuity and reducing the footprint of voltage regulators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the size of passive devices is reduced to increase circuit density, then the footprint of voltage regulators is reduced, but the electrical properties such as inductance deteriorate
Solution Approach 1:
The patent embeds prefabricated passive devices inside cavities within the substrate core, nesting components within the substrate structure itself. This allows the passive devices to be integrated into the voltage regulator footprint without increasing the overall package size, while maintaining their electrical properties through proper cavity design and component selection
Solution Approach 2:
The patent transitions from planar integration to three-dimensional integration by embedding passive devices vertically within the substrate core. This uses the vertical dimension (Z-axis) to house passive components, freeing up horizontal space and enabling higher circuit density while maintaining electrical performance
2Productivity
If prefabricated passive devices are embedded in the substrate core, then circuit density is increased, but the manufacturing complexity increases
Solution Approach 1:
The patent uses prefabricated passive devices that are manufactured separately and then embedded into the substrate core. This preliminary fabrication allows passive devices to be produced using optimized processes independent of the substrate manufacturing, reducing overall manufacturing complexity while achieving high circuit density
Solution Approach 2:
The patent divides the voltage regulator into separate functional segments: active devices on the substrate surface and passive devices embedded in cavities within the substrate core. This segmentation allows each component type to be optimized and manufactured independently, then integrated through established bonding techniques
3Reliability
If hybrid bonding techniques are used to integrate passive components, then electrical continuity is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent employs an underfill material as an intermediary between the passive devices and the substrate core during the embedding process. This underfill material facilitates alignment and bonding, providing a forgiving interface that reduces the stringency of precision requirements while ensuring reliable electrical and mechanical connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of compact electronic systems with improved power routing and increased circuit density by maintaining the electrical properties of passive devices, enhancing the efficiency of voltage regulators and overall system performance.
Implementation Method 1
a first substrate and a second substrate are bonded together using panel level thermal compression bonding
Implementation Method 2
embedding of high magnetic permeability inductors
Data Source
AI summary
An electronic device includes a substrate including a core layer; buildup layers on a first surface of the core layer, the buildup layers including first contact pads below the top surface of the buildup layers and second contact pads on a top surface of the buildup layers; and a discrete passive electronic component disposed in the buildup layers, the discrete component including bottom contact pads on a bottom surface of the discrete component and top contact pads on a top surface of the discrete component. The bottom contact pads of the discrete component are bonded to the first contacts pads of the buildup layers and the top contact pads of the discrete component are electrically connected to the second contact pads of the buildup layers.