Embedded Passive Substrate With Through-Hole Electrodes for Power Density
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Solution Overview
Problem
Conventional power modules face challenges in increasing power density, heat dissipation efficiency, and reducing thickness and connection impedance, which limits their performance in data processing centers and servers.
Innovation Solution
A substrate with a passive component embedded in an insulation layer, featuring a through-hole structure with a conductive and insulation part, and a second electrode that overlaps with the first electrode, enhancing heat dissipation and reducing thickness and connection impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If passive components and chips are individually optimized on a main printed circuit board, then component performance is improved, but the overall power density and heat dissipation capacity of the power module cannot be significantly increased
Solution Approach 1:
The patent merges the passive component mounting substrate and the chip mounting substrate into a single integrated substrate structure. The passive components are mounted on the first surface while the chip is mounted on the second surface of the same substrate, eliminating the need for separate substrates and interconnections. This integration directly increases power density by consolidating multiple functional elements into one compact module.
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional vertical integration structure. By stacking passive components and chips on opposite surfaces of the substrate and using through-substrate vias for interconnection, the design utilizes the vertical dimension to reduce the overall footprint while increasing power density and improving heat dissipation pathways.
2Length of moving object
If conventional substrate structures are used, then manufacturing is straightforward, but the substrate thickness cannot be reduced and connection impedance remains high
Solution Approach 1:
The through-hole structure is segmented into distinct functional zones: an insulation part for electrical isolation and a conductive part for signal transmission. This segmentation allows each portion to be optimized independently - the insulation part can be precisely controlled for thickness and positioning to reduce impedance, while the conductive part provides low-impedance pathways. The segmented design also simplifies manufacturing by allowing separate formation of insulating and conductive features.
Solution Approach 2:
The through-hole structure employs a composite design combining insulating material and conductive material within the same structural element. This composite approach enables the through-hole to simultaneously provide mechanical support, electrical isolation where needed, and low-impedance conduction paths where required, all while reducing overall substrate thickness through efficient multi-functional integration.
3Loss of energy
If electrodes are arranged in conventional non-overlapping patterns, then manufacturing is simple, but connection impedance is high and heat dissipation efficiency is low
Solution Approach 1:
The patent utilizes vertical stacking in the third dimension to create overlapping electrode arrangements between the first and second surfaces of the substrate. This three-dimensional electrode configuration increases the effective heat dissipation surface area and creates multiple thermal pathways without requiring lateral expansion. The overlapping electrodes form integrated heat dissipation structures that combine electrical function with thermal management.
Solution Approach 2:
The electrode structure merges electrical connection functions with heat dissipation functions into a single integrated feature. The overlapping electrodes create combined current pathways and thermal conduction pathways, eliminating the need for separate dedicated heat sinks or thermal management components. This merging reduces overall complexity while improving heat dissipation efficiency through the unified structure.
Data Source
AI summary
A substrate includes a first insulation layer, a passive component, a first through-hole structure, a second insulation layer and a second electrode. The first insulation layer has a top surface and a bottom surface. The passive component is embedded in the first insulation layer. The passive component includes a first conducting terminal. The first through-hole structure is formed in the first insulation layer. The first through-hole structure includes a conductive part and an insulation part disposed within the conductive part. The conductive part is in contact with the first conducting terminal and formed as a first electrode. The second insulation layer is disposed on portion of the conductive part that is close to the bottom surface of the first insulation layer. At least part of the second electrode is disposed on the second insulation layer. The second electrode is in contact with the first insulation layer.