Embedded Passive Substrate Vertical Stacking Design
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Solution Overview
Problem
The existing embedded passive substrate (EPS) technology faces challenges in reducing the size of printed circuit boards while maximizing efficiency, particularly in embedding multiple high-performance semiconductors, which requires innovative solutions for compact design and efficient signal transmission.
Innovation Solution
A substrate design featuring first and second insulating layers with cavities, a connection member penetrating through an adhesive layer, and electronic components disposed within these cavities, allowing for vertical stacking and reduced signal transmission distance, thereby minimizing size and enhancing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are embedded in multiple layers in a vertical direction, then the board size can be reduced and efficiency maximized, but the manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent transitions from planar embedding to vertical stacking by forming cavities in the insulating layer and placing passive components within these cavities at different heights. This three-dimensional arrangement reduces the horizontal board area while maintaining component capacity, directly addressing the size reduction goal despite increased manufacturing complexity
Solution Approach 2:
The patent embeds passive components inside cavities formed within the insulating layer, creating a nested structure where components are housed within the substrate itself. This nesting approach maximizes space utilization and reduces overall board size while organizing multiple components in a compact vertical configuration
2Quantity of substance
If the number of passive components is increased to support high capacity, then the functionality is improved, but the board size increases
Solution Approach 1:
The patent arranges passive components in multiple vertical layers within cavities of the insulating substrate, transitioning from two-dimensional planar placement to three-dimensional stacking. This enables a greater quantity of components to be accommodated within the same board footprint by utilizing the vertical dimension for component organization
Solution Approach 2:
The patent combines multiple passive components into a single integrated insulating substrate structure with embedded cavities. Rather than placing discrete components on the board surface, they are merged into the substrate itself through embedding, reducing the overall board area required while maintaining high component density
3Reliability
If connection distance between passive components is shortened to improve signal transmission, then signal efficiency is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent positions passive components vertically above or near each other in the stacking direction within the insulating substrate, creating short connection paths through the vertical dimension. This vertical proximity reduces the horizontal distance between connection points, improving signal transmission efficiency while the structured cavity formation provides alignment references that help manage precision requirements
4Area of stationary object
If embedded passive substrate technology is used to reduce board size, then the compactness is improved, but the manufacturing cost and process complexity increase
Solution Approach 1:
The patent forms cavities and prepares the insulating substrate structure before embedding the passive components. This preliminary preparation of the substrate architecture enables subsequent batch processing of component placement and connection formation, reducing overall manufacturing complexity and cost despite the advanced embedding technology required for compact board design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the substrate size, improves signal transmission efficiency by shortening connection distances, simplifies the manufacturing process through batch stacking, and lowers costs.
Implementation Method 1
a first adhesive layer disposed between the first and second insulating layers
Data Source
AI summary
A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.