Embedded Passive Components in Substrate for Low Impedance
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Solution Overview
Problem
Passive components in electronic component packages protrude from the surface, increasing the overall size and impedance, and consuming routing space.
Innovation Solution
Embedding passive components within a substrate using backside cavities and through vias, which minimizes thickness and impedance by electrically connecting them to short vias, preserving routing space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components are mounted on the surface of the interposer using surface mount technology, then the components can be easily installed and connected, but the components protrude from the surface increasing the overall size of the electronic component package
Solution Approach 1:
The passive component is embedded within a cavity formed in the interposer substrate, nesting the component inside the substrate structure rather than mounting it on the surface. This embedding approach reduces the overall package size while maintaining component functionality and accessibility through vias.
Solution Approach 2:
The component placement transitions from a two-dimensional surface mount configuration to a three-dimensional embedded configuration within the substrate thickness. By utilizing the vertical dimension and forming cavities at different depths, the design achieves compact integration without increasing the planar footprint.
2Ease of manufacture
If passive components are mounted on the surface of the interposer, then routing connections can be established, but the protruding components increase impedance
Solution Approach 1:
Embedding the passive component within the substrate cavity reduces the protrusion height, which in turn reduces the parasitic inductance and impedance associated with long via connections. The component is positioned closer to the signal traces, minimizing the current path length and reducing impedance effects.
3Ease of manufacture
If passive components are mounted on the surface of the interposer, then components can be connected to routing, but routing space is consumed
Solution Approach 1:
By moving component placement from the two-dimensional surface to the three-dimensional interior of the substrate, the design frees up valuable surface routing space. Multiple components can be embedded at different depths and positions within the substrate volume, allowing more efficient utilization of the available routing area on the surface.
Data Source
AI summary
An array includes a substrate having a frontside surface and a backside surface. A backside cavity is formed in the backside surface. Backside through vias extend through the substrate from the frontside surface to the backside surface. Embedded component through vias extend through the substrate from the frontside surface to the backside cavity. An embedded component is mounted within the backside cavity and coupled to the embedded component through vias. In this manner, the embedded component is embedded within the substrate. By embedding the embedded component within the substrate, the overall thickness of the array is minimized. Further, by electrically connecting the embedded component to the embedded component through vias, which are relatively short, the impedance between active surface ends of the embedded component through vias and the bond pads of the embedded component is minimized thus providing superior power management. Further, routing space on the frontside surface and/or the backside surface is preserved.