Embedded Passive Component Layout for Compact Thermal Dissipation
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Solution Overview
Problem
Existing semiconductor arrangements face challenges in reducing installation space and improving heat dissipation, particularly for passive components like resistance sensors and NTC thermistors, which are often bulky and require additional fasteners for mounting.
Innovation Solution
Integrating passive components completely within a recess of a first metallization on a dielectric material layer, ensuring direct contact and eliminating the need for additional fasteners, while using metallurgical bonds or force-fit connections to enhance thermal conductivity and reduce stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If passive components are mounted on the substrate surface using conventional methods, then they can be easily installed and connected, but they occupy excessive installation space and have poor heat dissipation
Solution Approach 1:
The passive component is nested within a recess formed in the first metallization layer, allowing the component to be integrated into the substrate structure rather than mounted on the surface. This nesting approach reduces the overall installation space while maintaining ease of manufacture through standardized recess formation processes
Solution Approach 2:
The solution transitions from two-dimensional surface mounting to three-dimensional integration by forming a recess in the metallization layer. This dimensional change allows the passive component to be embedded within the substrate structure, significantly reducing the footprint and installation space required
2Temperature
If passive components are mounted on the substrate surface, then they can be easily connected electrically, but heat dissipation is insufficient
Solution Approach 1:
By nesting the passive component within the recess of the first metallization layer, the component achieves direct thermal contact with the highly conductive metallization structure. This embedded configuration provides superior heat dissipation pathways compared to surface mounting, while the recess structure itself serves as the connection interface, simplifying the overall connection structure
Solution Approach 2:
The recess structure combines multiple functions: it provides mechanical support, establishes electrical connection, and serves as a thermal management pathway. By merging these functions into a single integrated structure rather than separate mounting hardware, the solution improves heat dissipation while reducing device complexity
3Strength
If additional fasteners are used to secure passive components, then mechanical strength is improved, but manufacturing complexity and installation time increase
Solution Approach 1:
The passive component is nested within a recess formed directly in the first metallization layer, eliminating the need for separate fasteners. The recess walls provide mechanical retention through friction and geometric interlocking, achieving sufficient mechanical strength while streamlining the manufacturing process by reducing assembly steps
Solution Approach 2:
The solution extracts and eliminates the need for additional fastener components by integrating the retention function directly into the recess structure of the first metallization layer. This removal of unnecessary components simplifies manufacturing and improves productivity while maintaining adequate mechanical strength through the recess geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces installation space and improves heat dissipation, enhances manufacturing efficiency, and increases the reliability and service life of the semiconductor arrangement by ensuring robust thermal connections.
Implementation Method 1
improves heat dissipation
Data Source
Figure 1~3
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Figure 6~7
AI summary
The invention relates to an arrangement (2) for a semiconductor arrangement (50) comprising at least one passive component (4) and a substrate (6), the substrate (6) comprising a dielectric material layer (8) and a first metallization (10) arranged on the dielectric material layer (8). In order to reduce the installation space of the arrangement (2) and to enable improved heat dissipation, it is proposed that the passive component (4) is arranged completely in a cutout (14) of the first metallization (10) and bears directly on the dielectric material layer (8).