Embedded Passive Substrate Structure for Void-Free Encapsulation
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Solution Overview
Problem
Existing semiconductor packages face issues due to thickness discrepancies between core substrates and passive components, leading to void formation and alignment difficulties during encapsulant filling, especially when embedding silicon capacitors.
Innovation Solution
A passive component embedded substrate design that includes a core substrate with a cavity, a passive component with a thickness supplementary layer, and an encapsulant, where the supplementary layer and part of the passive component are within the cavity, ensuring the thicknesses are balanced and aligned, thereby preventing voids and alignment issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a passive component is embedded on a substrate with a semiconductor package, then high reliability and excellent electrical characteristics are achieved, but void formation and alignment difficulties occur due to thickness differences between the core substrate and passive component
Solution Approach 1:
A thickness supplementary layer is introduced as an intermediary element between the passive component and the core substrate. This layer compensates for the thickness difference, enabling proper alignment and preventing void formation during encapsulant filling while maintaining the electrical characteristics of the passive component
Solution Approach 2:
The thickness of the passive component assembly is modified by adding the thickness supplementary layer. This parameter change balances the thickness between the core substrate and passive component, resolving the alignment and void formation issues without affecting the electrical performance
2Reliability
If a passive component is embedded on a substrate with a semiconductor package, then high reliability is achieved, but void formation occurs during encapsulant filling due to thickness differences
Solution Approach 1:
The thickness supplementary layer acts as a mediator that eliminates the thickness discrepancy causing void formation. By providing the missing thickness, it ensures uniform encapsulant filling and prevents voids while preserving the electrical characteristics of the passive component
Solution Approach 2:
The thickness supplementary layer is applied in advance to prevent void formation before encapsulant filling occurs. This preliminary compensation for thickness difference eliminates the root cause of void formation, ensuring reliable encapsulation
Data Source
AI summary
A passive component embedded substrate is provided and includes a core substrate including a core insulating layer that includes a cavity, a passive component, a thickness supplementary layer attached to a first surface of the passive component, and an encapsulant that fills the cavity and is on the passive component, wherein the thickness supplementary layer and at least a portion of the passive component is within the cavity.