Embedded PCB Adhesive Layer Fixation
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Solution Overview
Problem
Embedded printed circuit boards experience movement and rotation of electronic devices during the pressurization of insulating layers, leading to design deviations.
Innovation Solution
A printed circuit board design incorporating an insulating layer with embedded electronic devices and an adhesive layer to fix the devices, including a guide layer for proper arrangement and an adhesive layer for secure bonding, allowing for a desired thickness and reducing movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating layers are pressurized to fix electronic devices, then the devices are secured in position, but the devices move and rotate causing design deviations
Solution Approach 1:
The adhesive layer is applied to the insulating layer before the electronic devices are placed, creating a pre-prepared bonding surface. This preliminary action ensures that when devices are positioned and pressurized, they are immediately secured without movement or rotation, preventing design deviations while achieving reliable fixation
Solution Approach 2:
The adhesive layer acts as an intermediary substance between the insulating layer and the electronic devices. This mediator provides both the bonding strength needed for reliable fixation and the positional stability needed to prevent movement during pressurization, thereby resolving the contradiction between fixation reliability and manufacturing precision
2Ease of manufacture
If electronic devices are embedded in insulating layers, then component mounting is achieved, but device movement and rotation occur during pressurization
Solution Approach 1:
The adhesive layer is pre-applied to the insulating layer before device embedding, creating immediate bonding contact. This preliminary action ensures that during the manufacturing process and subsequent pressurization, devices remain stable in their embedded positions without movement or rotation, while maintaining ease of component mounting
Solution Approach 2:
The adhesive layer serves as an intermediary that enables easy device embedding while simultaneously providing positional stability. The adhesive properties allow devices to be mounted efficiently, and the bonded connection prevents movement during pressurization, resolving the contradiction between manufacturing ease and position stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electronic device movement, enabling precise assembly and reducing design deviations, while allowing for variable thickness and asymmetrical connections, and reducing the pitch of terminals to less than 150 μm.
Implementation Method 1
an adhesive layer for fixing the electronic devices
Data Source
AI summary
Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.