Embedded PCB Bridge Structure for Precise Die-to-Die Alignment
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Solution Overview
Problem
Existing technologies face limitations in embedding silicon bridges in substrates due to alignment issues, bridge position tolerance, via processing tolerance, and pad exposure tolerance, which hinder the commercialization of high bandwidth memory and die-to-die connection with fine circuit line widths.
Innovation Solution
A printed circuit board design that embeds a bridge in a substrate with a metal post covered by an insulating material, using a second insulating material with higher transparency to improve alignment, and includes a redistribution pattern connected to the metal post, allowing for precise mounting and simplified manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a silicon interposer is used to increase the number of cores and enable high bandwidth memory, then the functional requirements are met, but the price increases and the assembly process becomes complicated
Solution Approach 1:
The patent replaces the expensive silicon interposer with a cost-effective organic substrate that can be discarded after serving its purpose of enabling die-to-die connection. The organic substrate acts as a temporary carrier that facilitates the connection between multiple dies without requiring complex assembly processes, thereby reducing both price and assembly complexity while maintaining the ability to increase the number of cores.
2Ease of manufacture
If a silicon bridge is embedded in a substrate, then connection functionality is achieved, but alignment precision deteriorates due to bridge position tolerance, via processing tolerance, and pad exposure tolerance
Solution Approach 1:
The patent introduces a metal post as an intermediary element between the bridge and the substrate. This metal post serves as a precise alignment reference that mediates the connection process, allowing for accurate positioning of the bridge while embedding it in the substrate. The metal post compensates for tolerances in bridge position, via processing, and pad exposure, thereby maintaining high alignment precision while facilitating ease of manufacture.
Data Source
AI summary
A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.