Embedded PCB Bridge Structure Without Cavity or Adhesive Bonding
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Solution Overview
Problem
The manufacturing of highly integrated printed circuit boards (PCBs) for 5G high-speed communications and artificial intelligence is hindered by increased costs due to low yield and poor quality of power and signal transfer in embedded multi-die interconnect bridges (EMIBs), which require expensive semiconductor processes and additional cavity forming and adhesive bonding steps.
Innovation Solution
A substrate design that embeds a bridge without forming a cavity and using separate adhesives, featuring a first and second printed circuit board layer with insulating and wiring layers, a bridge with circuit wirings, and bridge insulating layers stacked in different directions, improving electrical characteristics for high-speed signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If EMIB technology is used to pattern microcircuit using silicon bridge, then pattern interval and bridge thickness are reduced, but manufacturing costs increase due to expensive semiconductor process equipment
Solution Approach 1:
The patent changes the material parameter from silicon to organic substrate, and changes the manufacturing process parameters from semiconductor fabrication to PCB fabrication techniques. This allows achieving fine pattern intervals through organic substrate's inherent properties and standard PCB processes, avoiding expensive semiconductor equipment while maintaining manufacturing precision.
Solution Approach 2:
The patent replaces expensive silicon bridges with cost-effective organic substrate bridges. The organic substrate serves as a disposable, low-cost alternative that achieves the same functional purpose without requiring costly semiconductor manufacturing infrastructure, thereby reducing manufacturing costs while maintaining pattern quality.
2Productivity
If EMIB technology is used for microcircuit manufacturing, then integration is achieved, but power and signal transfer quality deteriorates
Solution Approach 1:
The patent uses composite material structure combining organic substrate with metal wiring layers and insulating layers. This composite approach maintains high integration while improving power and signal transfer quality through optimized material properties of organic substrates, which offer better electrical characteristics compared to traditional silicon bridges.
Solution Approach 2:
The patent transitions from planar silicon bridge structures to three-dimensional stacked organic substrate layers with embedded wiring. This dimensional change allows for improved signal routing and reduced interference, enhancing power and signal transfer quality while maintaining high integration levels through vertical stacking.
3Ease of manufacture
If cavity forming process is used to insert bridge into substrate, then bridge embedding is achieved, but manufacturing complexity and post-management costs increase due to additional adhesive bonding steps
Solution Approach 1:
The patent merges the bridge structure with the substrate structure by directly forming the organic substrate bridge as an integrated part of the PCB layer structure. This eliminates the need for separate cavity formation and adhesive bonding steps, reducing manufacturing process complexity while achieving effective bridge embedding through structural integration.
Solution Approach 2:
The organic substrate bridge structure is designed to be self-supporting and self-integrating with the PCB layers. The bridge inherently connects to the substrate through the layered structure without requiring external adhesive materials or separate bonding processes, thereby simplifying manufacturing and reducing post-management costs associated with adhesive degradation.
Data Source
AI summary
A substrate includes: a first printed circuit board layer including a first insulating layer and a first wiring layer, disposed on a lower surface of the first insulating layer; a second wiring layer, disposed on an upper surface of the first insulating layer; a bridge disposed above the first printed circuit board layer and including circuit wirings; a first bridge insulating layer and a second bridge insulating layer, disposed in the bridge and on which the circuit wirings are disposed, respectively; and a second printed circuit board layer including a second insulating layer surrounding side surfaces of the bridge and covering the first insulating layer and the second wiring layer. A first stacking direction in which the first insulating layer and the second insulating layer are stacked and a second stacking direction in which the first bridge insulating layer and the second bridge insulating layer are stacked are different.