Embedded PCB Component Carrier Lamination to Reduce Warpage
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Solution Overview
Problem
Conventional packaging methods for electronic components in printed circuit boards (PCBs) lead to warpage and bending, especially under temperature changes, and require complex adhesive processes.
Innovation Solution
A component carrier is manufactured by embedding electronic components in a core with a recess, using a dielectric sheet to mechanically fix and surround the component, followed by lamination with additional dielectric layers to ensure symmetry and stability, reducing warpage through matched thermal expansion coefficients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional adhesive methods are used to attach electronic components before lamination, then component attachment is achieved, but warpage and bending occur under temperature changes
Solution Approach 1:
The patent removes the adhesive layer from the component attachment process, replacing it with direct mechanical embedding of components into recesses formed in the PCB core. This extraction of the adhesive element eliminates the source of differential thermal expansion that causes warpage, while still achieving secure component attachment through the recess structure and subsequent lamination.
Solution Approach 2:
The patent introduces asymmetry by forming recesses in the PCB core that are specifically shaped and positioned to accommodate electronic components. This asymmetric structural modification allows components to be mechanically embedded rather than adhesively bonded, creating a more thermally stable assembly that resists warpage while maintaining secure attachment.
2Reliability
If adhesive layers are used to secure components, then component fixation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent eliminates the adhesive layer and associated application processes from the manufacturing sequence. Components are secured through mechanical embedding in recesses and subsequent lamination, removing the need for adhesive dispensing, positioning, and curing steps, thereby simplifying the manufacturing process while maintaining reliable component fixation.
Solution Approach 2:
The patent combines the component attachment function with the lamination process itself. The recesses in the core and the lamination layers work together as an integrated mechanical fixation system, eliminating the need for separate adhesive application and curing processes, thus reducing manufacturing complexity while achieving secure component fixation.
3Strength
If additional adhesive layers are added to improve component attachment, then attachment strength increases, but warpage tendency increases
Solution Approach 1:
The patent removes adhesive layers from the construction, replacing them with a mechanical embedding approach using recesses in the core. This eliminates the source of differential thermal expansion that causes warpage while maintaining strong component attachment through the recess structure and lamination integration.
Solution Approach 2:
The patent employs a composite structure where the core material with integrated recesses works in conjunction with lamination layers to provide both mechanical support and secure component embedding. This composite approach achieves strong attachment without requiring additional adhesive layers, thereby preventing warpage while maintaining attachment strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a stable, symmetrical, and flat component carrier with high registration accuracy and reduced warpage, even under temperature variations, eliminating the need for additional adhesives and enhancing design flexibility.
Implementation Method 1
a dielectric sheet is laminated thereto and surrounds the electronic component so that material of the sheet fills a gap between the recess and the electronic component
Implementation Method 2
The sheet and the further dielectric layer structure are cured
Implementation Method 3
reducing warpage through matched thermal expansion coefficients
Data Source
Figure 1~2
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Figure 5~6
AI summary
A component carrier (400) comprising a core (100) having a recess (102), an electronic component (306) arranged in the recess (102), a laminated electrically insulating sheet (402) covering at least part of the core (100) and of the electronic component (306) and filling a gap between a lateral surface (300) of the electronic component (306) and a lateral surface (104) of the core (100) in the recess (102), and a further electrically insulating layer structure (600) laminated on top of the sheet (402).