Embedded Printed Circuit Board With Cavity Segmentation
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Solution Overview
Problem
Conventional embedded printed circuit boards face challenges in adding new sensor elements due to limited space and high production costs, leading to the discarding of expensive components when defects occur.
Innovation Solution
The design incorporates a first and second cavity structure within the insulating substrate, allowing for the exposure of conductive layers and the use of an adhesive layer to enhance signal transmission and protect sensor elements, enabling the separate installation of high-priced elements only on tested, defect-free boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If sensor elements are mounted on a conventional printed circuit board, then the portable terminal gains various functions, but the limited area of the printed circuit board makes it difficult to add new sensor elements
Solution Approach 1:
The patent transitions from mounting sensor elements on the two-dimensional surface of the printed circuit board to embedding them within three-dimensional cavities formed in the insulating substrate. This dimensional change allows additional sensor elements to be incorporated without increasing the board's footprint area, thereby resolving the contradiction between adding functionality and maintaining limited space.
2Adaptability or versatility
If elements are mounted in a cavity of the insulating substrate, then the portable terminal can accommodate sensor elements, but when the embedded printed circuit board has a defect, the high-priced elements must be discarded
Solution Approach 1:
The patent divides the insulating substrate into multiple independent cavities, allowing sensor elements to be mounted in separate compartments. This segmentation isolates each element within its own cavity, so that if a defect occurs in one area, only the affected element needs to be replaced rather than discarding the entire board and all other high-priced elements, thus reducing material loss.
3Adaptability or versatility
If a cavity is formed in the insulating substrate to mount elements, then sensor elements can be embedded, but the manufacturing process becomes more complex
Solution Approach 1:
The patent incorporates cavity formation as a preliminary step during the printed circuit board manufacturing process, rather than adding it as a separate post-processing operation. By integrating cavity creation into the existing manufacturing workflow at an early stage, the patent enables sensor element embedding while avoiding significant increases in manufacturing complexity.
Data Source
AI summary
Provided is an embedded printed circuit board, including: a first insulating substrate including a first cavity and a second cavity; a first element disposed in the first cavity; an adhesive layer for adhering the first insulating substrate to the first element and including an opening to which the first element is exposed; and an second insulating substrate forming a bonding layer of a lower surface of the first insulating substrate and a bottom surface of the second cavity.