Embedded PCB Component Bonding via Inversion and Semi-Additive Process
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Solution Overview
Problem
Existing methods for embedding components in printed circuit boards often result in delamination issues due to cavities between the chip and adjacent layers, leading to detachment risks during the buildup of additional layers.
Innovation Solution
A method involving a core with insulating and conductor layers, where a component is embedded with its contacts in the plane of the conductor layer, using a photoimageable epoxy-based lacquer to fill spaces between contacts, followed by a semi-additive process for conductor material deposition and flash-etching to form a conductor pattern, ensuring all connections and paths are in one plane without detaching layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a component is embedded with contacts facing away from the substrate using conventional methods, then the component can be mounted, but cavities remain between the chip and adjacent layers causing delamination issues
Solution Approach 1:
The invention inverts the conventional embedding approach by orienting component contacts to face the same direction as the substrate surface, rather than facing away. This inversion eliminates the cavity formation problem that causes delamination, as the component sits flush with the substrate surface plane. The contacts are arranged to be accessible from the outer surface, reversing the traditional mounting orientation.
Solution Approach 2:
The invention transitions from a three-dimensional embedded structure with contacts facing away (requiring additional layer buildup) to a two-dimensional surface-level configuration where contacts lie in the plane of the outer surface. This dimensional change eliminates the need for complex cavity-filling procedures and reduces the risk of delamination during subsequent manufacturing steps.
2Ease of manufacture
If additional layers are built up over embedded components with cavities, then complete circuit structures can be formed, but the risk of layer detachment increases
Solution Approach 1:
The invention performs preliminary action by pre-orienting component contacts to face the substrate surface before subsequent layer buildup. This preliminary configuration ensures that when additional conductor layers and insulating layers are applied, there are no cavities or voids that would compromise adhesion. The flush mounting is established in advance, preventing future delamination issues.
3Length of stationary object
If components are embedded with contacts in the plane of the outer surface, then thinner printed circuit boards can be produced, but new bonding methods are required
Solution Approach 1:
The invention extracts the problematic cavity formation from the embedding process by taking out the conventional approach of mounting contacts facing away. Instead, it extracts only the essential function of component mounting while eliminating the harmful cavity structure, achieving flush mounting that simplifies subsequent bonding operations and reduces overall board thickness.
Data Source
AI summary
Methods for the bonding of a component embedded into a printed circuit board are provided. A printed circuit board is also provided with at least one insulated layer and at least one structured conductor layer with conductor paths, with at least one component, which, by means of an adhesive layer, is embedded into a recess of the printed circuit board, with its contacts essentially being situated in the plane of an outer surface of the printed circuit board exhibiting the at least one conductor layer, and with conductive connections between the contacts of the components and the conductor paths of the conductor layer.