Embedded PCB Connectors for Robust Board-to-Board Alignment

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Solution Overview

Problem

Previous information handling systems face challenges with ultra-low profile connectors, which result in reduced robustness and mechanical alignment issues due to shorter pin lengths, leading to problems with shock, vibration, and blind mating.

Innovation Solution

Embedding connectors within printed circuit boards to increase pin length and robustness, allowing for a smaller board-to-board distance without reducing pin length, thereby enhancing mechanical strength and alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If ultra-low profile connectors are used to reduce board-to-board distance, then the compact design is achieved, but the pin length is reduced leading to reduced robustness and mechanical alignment issues

Engineering Contradiction:
Improveboard-to-board distanceVSAvoidconnector robustness
Core Design Contradiction:
Volume of moving objectVSStrength

Solution Approach 1:

The connector is transitioned from a surface-mounted configuration to an embedded configuration within the PCB substrate. This dimensional change allows the connector to utilize the PCB thickness as part of its structural support, enabling longer pin lengths while maintaining a compact overall profile. The embedded structure provides mechanical reinforcement that surface-mounted connectors cannot achieve.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The connector is nested within the PCB structure, with the PCB substrate acting as a housing or cavity that contains the connector. This nesting approach allows the connector to be supported by the surrounding PCB material, providing enhanced mechanical strength and alignment stability while maintaining a compact form factor.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Volume of moving object

If ultra-low profile connectors are used to achieve compact design, then board-to-board distance is reduced, but mechanical alignment issues and shock/vibration resistance are worsened

Engineering Contradiction:
Improveboard-to-board distanceVSAvoidshock and vibration resistance
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

By embedding the connector within the PCB, the structure transitions from a two-dimensional surface mounting to a three-dimensional integrated structure. This allows the PCB substrate to provide multi-directional mechanical support, significantly improving resistance to shock and vibration while maintaining compact dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The embedded connector structure creates a composite assembly where the PCB substrate and connector work together as an integrated mechanical unit. The PCB material provides structural reinforcement and damping properties that enhance the overall reliability and shock/vibration resistance of the connection.

Inventive Principle:
Principle #40Composite materials

3Strength

If connector pin length is increased to improve robustness, then mechanical strength is enhanced, but board-to-board distance increases reducing compactness

Engineering Contradiction:
Improveconnector robustnessVSAvoidboard-to-board distance
Core Design Contradiction:
StrengthVSVolume of moving object

Solution Approach 1:

The connector structure is merged with the PCB substrate through embedding, combining the functions of structural support and electrical connection. This integration allows the PCB thickness to contribute to the overall connector height, enabling long pins for robustness while maintaining compact board-to-board distance.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The solution moves the connector from surface-level attachment to embedded positioning within the PCB thickness dimension. This allows the connector to achieve greater effective pin length through the PCB substrate while the overall profile remains compact, as the extended length is absorbed within the PCB volume rather than extending outward.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS11444400B2Information handling system with a printed circuit board having an embedded interconnect
Publication Date: 2022.09.13 DELL PROD LP
  • US11444400B2 patent drawing
  • US11444400B2 patent drawing
  • US11444400B2 patent drawing

AI summary

An information handling system includes first and second printed circuit boards (PCBs), and first and second connectors. The first PCB includes a first top surface, a first bottom, and a first plurality of side surfaces extending between the first top and first bottom surfaces. The first connector is embedded within the first PCB, and extends from the first bottom surface toward the first top surface. A first height of the first connector is substantially equal to a first thickness of the first PCB. The second PCB includes a second top surface, a second bottom, and a second plurality of side surfaces extending between the second top and second bottom surfaces. The second connector is embedded within the second PCB, and extends from the second bottom surface toward the second top surface. A second height of the second connector is greater than a second thickness of the second printed circuit board.