Embedded PCB Core Stacking for Thin Multi-Chip Interconnects
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Solution Overview
Problem
Existing printed circuit boards face challenges in reducing thickness, simplifying connection and signal paths, and improving reliability, particularly in multi-chip packages with various electronic components.
Innovation Solution
A printed circuit board design featuring a multi-layer structure with thin core layers, embedded elements, and connection layers made of SiO2, SiN, and SiCN, allowing direct electrical connections between elements through pads, and hybrid bonding for core layer integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional multi-chip package structures are used with various electronic components embedded in the board, then functional capabilities are achieved, but the board thickness increases and connection paths become complex
Solution Approach 1:
The patent transitions from planar connections to three-dimensional vertical stacking by embedding multiple core layers with embedded elements at different heights. Connection paths extend in the vertical dimension through vias and connection layers, enabling direct connections between elements on different core layers without requiring long lateral traces, thus reducing board thickness while simplifying signal paths.
Solution Approach 2:
The patent embeds electronic elements directly within the core layers themselves, nesting components inside the structural layers rather than mounting them on the surface. Multiple core layers are stacked and interconnected, creating a nested configuration where elements are embedded within the board structure, reducing overall thickness and simplifying connections.
2Adaptability or versatility
If more electronic components are embedded in the board to increase functionality, then device capabilities improve, but manufacturing complexity and reliability challenges increase
Solution Approach 1:
The patent divides the board into multiple discrete core layers, each containing specific embedded elements and insulation layers. This segmentation allows independent fabrication and testing of individual core layers before assembly, improving manufacturing reliability. Each layer can be optimized for specific functions while maintaining overall system versatility.
Solution Approach 2:
The patent employs composite material structures combining conductive elements, insulating layers, and connection materials (including SiO2, SiN, and SiCN) to create multi-functional core layers. These composite structures provide both mechanical support and electrical functionality, enabling diverse device capabilities while maintaining manufacturing reliability through standardized material systems.
3Strength
If connection layers with multiple materials (SiO2, SiN, SiCN) are used between core layers, then structural integrity and signal transmission are improved, but manufacturing process complexity increases
Solution Approach 1:
The patent utilizes materials with different dielectric constants (SiO2, SiN, SiCN) to optimize signal transmission characteristics and structural properties at different locations. By changing material parameters based on functional requirements, the patent achieves improved structural integrity and signal performance while managing manufacturing complexity through selective material application.
Data Source
AI summary
A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the first core layer and connected to the first element; a third pad and a fourth pad disposed on the second core layer and connected to the second element; and first connection layers interposed between one surface of the first core layer and one surface of the second core layer. The first pad and the third pad contact each other, and the first connection layers include at least one material of SiO2, SiN, and SiCN.