Embedded PCB Core Laminate Without Via Access to Components
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Solution Overview
Problem
Current circuit board manufacturing methods require the formation of vias to access embedded functional components, increasing manufacturing steps and costs, while also facing challenges in achieving miniaturization and increased functionality within a given space.
Innovation Solution
A circuit board core material with embedded electronic components, such as capacitors, is developed, where the components are electrically connected to the surface without the need for vias, utilizing a laminate structure with a prepreg layer and clad layers, allowing for direct electrical contact and eliminating the necessity for blind via formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are formed to access embedded functional components, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies preliminary action by forming conductive pathways within the laminate structure during the manufacturing process itself, rather than forming vias after the component is embedded. The conductive material is placed and cured in advance to create built-in electrical connections that automatically contact the embedded component terminals, eliminating the need for subsequent via formation operations.
2Reliability
If vias are formed to access embedded functional components, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges the electrical connection function with the laminate structure itself. The conductive material is integrated into the laminate layers during manufacturing, combining the structural and electrical connection functions into a single integrated system. This eliminates separate via formation steps and associated costs for drilling, plating, and isolating vias.
3Volume of moving object
If functionality is added within circuit board thickness, then volumetric efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes the thickness dimension of the laminate structure to embed functional components and create three-dimensional electrical connections. By stacking conductive layers and embedding components within the laminate thickness, the design achieves volumetric efficiency while maintaining manufacturing simplicity through integrated layer construction rather than post-assembly via formation.
Data Source
AI summary
An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor.