Embedded PCB Electrode Structure for Spot-Welding Heat Control
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Solution Overview
Problem
Conventional electrode structures on circuit boards are thick, leading to increased PCB space usage, larger distances between electrodes and electrical components, and residual heat issues during spot-welding.
Innovation Solution
A metal structure with a U or L shape, comprising copper and possibly tin or nickel layers, is integrated into the circuit board to form electrodes, allowing for reduced thickness and space between the electrode and electrical components, with electrical components such as passive or active devices embedded within the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a thick electrode is used on the circuit board, then the influence of residual heat during spot-welding is reduced, but the PCB space occupied increases and the distance between the electrode and electrical components becomes larger
Solution Approach 1:
The electrode structure transitions from a conventional planar thick electrode to a three-dimensional cavity-integrated electrode. The electrode is formed within a cavity in the circuit board, allowing the electrode material to extend vertically into the board thickness rather than only horizontally on the surface. This dimensional change enables sufficient electrode mass for heat dissipation while minimizing surface area occupation.
Solution Approach 2:
The electrode structure is nested within a cavity formed in the circuit board substrate. The electrode material is positioned inside the cavity space, effectively utilizing the board's internal volume. This nesting approach allows the electrode to be embedded within the board structure rather than occupying additional surface area, resolving the contradiction between electrode mass requirements and PCB space constraints.
2Object-affected harmful factors
If a thick electrode is used on the circuit board, then the influence of residual heat during spot-welding is reduced, but the distance between the electrode and electrical components becomes larger
Solution Approach 1:
The electrode is repositioned from a surface-mounted thick structure to an internally embedded structure within the circuit board cavity. This allows the electrode to be located closer to electrical components mounted on the board surface, reducing the vertical distance while maintaining sufficient electrode mass for heat management through the cavity's depth.
Solution Approach 2:
By nesting the electrode within the circuit board cavity, the electrode is positioned in optimal proximity to electrical components. The cavity depth provides the necessary electrode mass for heat dissipation, while the electrode's embedded position minimizes the distance to components, eliminating the trade-off between heat management and component accessibility.
3Object-affected harmful factors
If conventional thick electrodes are used, then residual heat during spot-welding is managed, but the circuit board size increases
Solution Approach 1:
The electrode structure is nested within cavities formed in the circuit board, utilizing the board's internal volume rather than increasing external dimensions. The cavity provides space for the electrode material to achieve sufficient mass for heat management while being contained within the board's existing footprint, preventing overall board size increase.
Solution Approach 2:
The electrode mass is achieved through vertical extension into the board thickness via cavity formation, rather than horizontal expansion on the board surface. This dimensional transition allows the electrode to provide adequate thermal management capacity while maintaining a compact board footprint, as the electrode volume is drawn from the board's depth dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the circuit board's size and cost, increases available space, minimizes residual heat impact, and decreases the distance between electrodes and components, enhancing overall efficiency and utilization.
Implementation Method 1
the metal structure is soldered to the circuit board
Data Source
AI summary
An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.