Embedded PCB Fluid Channels for Active IC Thermal Management
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Solution Overview
Problem
Existing thermal management systems for integrated circuits (ICs) face challenges in effectively dissipating heat due to increased component density and miniaturization, with cooling methods like fans and heat sinks struggling to maintain optimal temperatures and achieve reliable thermal connections, especially in high-power components with EMI shielding and varying stack-up heights.
Innovation Solution
A thermal management system with self-contained fluid channels built within a circuit board substrate, where fluids flow through these channels for active cooling or heating, maintaining components at a preferred temperature, and a conductive layer is applied to enhance thermal transfer, with a second circuit board enclosing the fluid channels to improve thermal and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If natural convection, radiation and/or heat conduction through the PCB is used for cooling, then the cooling method is simple, but it is insufficient to keep temperatures of the ICs below maximum operating limits
Solution Approach 1:
The patent implements fluid channels (microchannels) within the PCB substrate that transport coolant to directly cool high-power ICs. This hydraulic cooling system provides controlled and effective heat removal, enabling the PCB to handle high-power applications while maintaining proper thermal management.
2Temperature
If fans are used to circulate air for heat dissipation, then heat removal capability is improved, but air cannot penetrate EMI shields in high-power components
Solution Approach 1:
The patent replaces air-based convective cooling with liquid coolant flow through embedded microchannels. This hydraulic cooling system penetrates through EMI shields via the fluid channels, allowing effective heat removal from high-power ICs without being blocked by electromagnetic shielding structures.
Solution Approach 2:
The patent transitions from surface-level air cooling to three-dimensional internal fluid channel cooling within the PCB substrate. This dimensional change allows coolant to reach ICs through the substrate thickness, bypassing EMI shield obstacles that block top-down air flow.
3Temperature
If heat sinks are used to dissipate heat, then heat distribution over larger area is achieved, but reliable thermal connection between ICs and heat sink is difficult due to variations in stack-up height and parallelism
Solution Approach 1:
The patent merges the heat sink function directly into the PCB substrate by embedding fluid channels within the PCB layers. This integration eliminates the separate heat sink component and its associated connection issues, creating a unified thermal management system where the PCB itself serves as the heat dissipation structure.
Solution Approach 2:
The patent moves from external heat sink attachment (surface-level thermal connection) to internal fluid channel integration within the PCB substrate (three-dimensional thermal pathway). This dimensional integration ensures consistent thermal contact through the substrate structure, eliminating parallelism and height variation issues.
4Temperature
If fans and heat sinks are used for cooling, then heat is drawn away from ICs, but they are unable to regulate and keep the temperature at a predefined optimal operating temperature
Solution Approach 1:
The patent implements a dynamic thermal management system where coolant flow rate and temperature can be adjusted in real-time based on IC operating conditions. This enables active regulation of IC temperature to maintain optimal operating conditions, transitioning from static passive cooling to dynamic adaptive cooling.
Solution Approach 2:
The patent incorporates temperature sensing and control mechanisms that monitor IC temperature and adjust coolant flow accordingly. This feedback system enables precise temperature regulation, keeping ICs at predefined optimal operating temperatures rather than merely providing passive heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system effectively regulates the temperature of ICs by using fluid channels for active cooling/heating, maintaining optimal operational conditions and improving thermal transfer through conductive layers and connection channels, addressing the limitations of traditional cooling methods.
Implementation Method 1
fluid channels formed within the substrate of a circuit board to transfer heat away from an Integrated Circuit (IC) attached to the circuit board
Implementation Method 2
a conductive layer is applied to enhance thermal transfer
Data Source
AI summary
A thermal management system has a first circuit board. The first circuit board has a first circuit board dielectric layer. At least one fluid channel is formed through the first circuit board and along a width or length of the first circuit board, wherein the at least one fluid channel is encapsulated.