Embedded PCB Cooling With Heat Pipes for High-Density Power Devices
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Solution Overview
Problem
Conventional power control units (PCUs) with surface-mounted power devices suffer from low power density, high system inductance, and inefficient cooling due to the design's reliance on surface area exposure and external cooling systems, leading to increased volume and power loss, especially at high switching frequencies.
Innovation Solution
An embedded cooling system is introduced, featuring a printed circuit board (PCB) substrate with power device stacks and pulsating heat pipes that extend from the substrate to an external cooling assembly, providing direct thermal coupling and reducing thermal resistance by eliminating intermediate insulation layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power devices are surface-mounted on PCB, then ease of manufacture is improved, but power density decreases and volume increases
Solution Approach 1:
The patent transitions from surface-mount technology (2D placement on PCB surface) to through-hole mounting (3D placement penetrating PCB thickness). Power devices are mounted through holes in the PCB, utilizing the vertical dimension to achieve higher power density while maintaining compact form factor.
2Ease of operation
If conventional cooling systems are used with surface-mounted devices, then ease of operation is improved, but cooling efficiency decreases due to thermal resistance
Solution Approach 1:
The patent extracts and eliminates the thermal insulation layer that naturally exists between surface-mounted devices and the PCB surface. By mounting devices through holes, the cooling system directly contacts the device heat-generating surfaces, removing the thermal barrier and enabling efficient heat extraction.
3Ease of operation
If power cards extend distance from driver board, then ease of operation is improved, but system loop inductance increases causing power loss
Solution Approach 1:
The patent merges the power card with the driver board by embedding power devices directly within the PCB structure. This integration eliminates the physical separation and extended connections between power cards and driver boards, thereby reducing system loop inductance and associated power losses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances power density, reduces switching losses, and improves cooling efficiency by allowing for more direct heat transfer from power devices to the cooling system, maintaining lower running temperatures or enabling higher power output.
Implementation Method 1
one or more heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate
Data Source
AI summary
Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.