Embedded PCB Cooling Path for Direct Hot-Spot Heat Removal
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Solution Overview
Problem
Conventional cooling methods for heat-generating components on printed circuit boards (PCBs) face challenges due to high thermal resistance from intervening layers, making it difficult to maintain proper case or package temperature, especially for high-power electronics like GaN transistors.
Innovation Solution
An embedded PCB with a micro immersion cooling channel that uses a cryogenic coolant and non-conductive fluid, where a lid defines the cooling path and is sealed to the PCB with Indium, allowing direct fluid communication with heat-generating components, eliminating the need for intervening thermal interface materials and providing efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cold plate cooling methods are used, then cooling coverage is provided, but high thermal resistance from intervening layers prevents effective heat dissipation
Solution Approach 1:
The patent removes the cold plate intermediary component entirely, replacing it with direct immersion cooling where coolant flows directly through channels formed in the PCB substrate, eliminating thermal interface materials and intervening layers that cause high thermal resistance
Solution Approach 2:
The cooling channels are nested directly within the PCB substrate layers, with heat-generating components positioned to conduct heat directly into the coolant channels, creating a integrated thermal management structure that eliminates separate cooling components
2Temperature
If 3D printing is used to create microfluidic channels, then direct cooling is achieved, but fabrication complexity and manufacturing difficulty increase
Solution Approach 1:
The patent transitions from additive manufacturing (3D printing) to subtractive manufacturing (laser drilling and routing) parameters, using standard PCB fabrication techniques to create cooling channels that match the form factor and material properties of conventional PCBs
Solution Approach 2:
The PCB substrate serves multiple functions simultaneously: electrical circuit board, structural support, and cooling channel conduit, eliminating the need for separate 3D-printed cooling components and integrating thermal management into the existing PCB manufacturing ecosystem
3Ease of manufacture
If conventional embedded PCB designs are used, then manufacturing is simplified, but thermal performance is insufficient for high power electronics
Solution Approach 1:
The patent transitions from surface-mounted or top-side embedded cooling to through-substrate cooling channels that extend through the entire PCB thickness, allowing direct thermal contact between heat-generating components and coolant while maintaining standard PCB manufacturing processes
Solution Approach 2:
The patent uses copper-lined cooling channels within the PCB substrate, combining the electrical and thermal conductivity of copper with the structural and insulating properties of the PCB material, achieving superior thermal performance while maintaining manufacturing compatibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves effective heat dissipation with reduced thermal cross-talk and temperature differential, enabling increased power density and faster temperature control without requiring conventional cold plates or thermal insulation, thus addressing the limitations of existing cooling methods.
Implementation Method 1
A cooling path extends in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. The cooling path is in fluid communication with the at least one heat generating component.
Implementation Method 2
The at least one heat generating component can include a die embedded in the first PCB
Implementation Method 3
The seal element can include Indium
Data Source
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AI summary
Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component (104). A lid (106) is mounted to the PCB, wherein the lid (106) defines a cooling path (108) therein extending in a coolant flow direction from an inlet end of the cooling path (108) to an outlet end of the cooling path (108).