Embedded PCB Stackup With Hybrid Bonding for Thinner Multi-Chip Routing
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Solution Overview
Problem
Existing printed circuit boards face challenges in reducing thickness, simplifying connection and signal paths, and improving reliability, particularly in multi-chip packages with various electronic components.
Innovation Solution
A printed circuit board design featuring a multi-layer structure with embedded elements and connection layers made of SiO2, SiN, and SiCN, allowing direct electrical connections between elements through pads and connection layers, and a manufacturing method that includes forming cavities, embedding elements, and connecting core layers with hybrid bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional multi-chip package structures are used with various electronic components embedded in the board, then functional capabilities are achieved, but the board thickness increases and connection paths become complex
Solution Approach 1:
The patent transitions from planar connections to three-dimensional vertical stacking, where multiple core layers are stacked in the thickness direction with connection layers between them. This dimensional change allows signals to travel vertically through the stack rather than laterally across the board, significantly reducing the required board thickness while maintaining connection functionality.
Solution Approach 2:
The patent embeds connection layers within the stacked core layer structure, nesting the interconnection system inside the board itself rather than using external traces. The connection layers are positioned between core layers, creating a nested configuration that simplifies the overall connection path while reducing board thickness.
2Adaptability or versatility
If more electronic components are embedded in the board to increase functionality, then device capabilities improve, but reliability decreases due to increased complexity and potential failure points
Solution Approach 1:
The patent divides the board into multiple discrete core layers, each potentially containing different electronic components or functional elements. This segmentation allows for modular design where each layer can be independently manufactured and tested, improving overall reliability while maintaining versatile functionality through the stacked configuration.
Solution Approach 2:
The patent uses composite connection layers made of SiO2, SiN, and SiCN materials that combine the properties of different dielectric materials. This composite structure provides both electrical insulation and mechanical stability, enabling reliable inter-layer connections while supporting diverse electronic components across multiple core layers.
3Device complexity
If connection layers are added between core layers to enable direct electrical connections, then connection paths are simplified, but manufacturing complexity increases
Solution Approach 1:
The connection layers are formed between core layers during the manufacturing process before final assembly, allowing for preliminary establishment of inter-layer connections. This preliminary action enables direct electrical connections to be built into the structure during fabrication rather than requiring complex post-assembly routing, simplifying the overall connection path despite added manufacturing steps.
Data Source
AI summary
A printed circuit board and a method of manufacturing the same are disclosed. The printed circuit board includes: a first core layer including a first insulating layer and a first core; a second core layer including a second insulating layer and a second core; a first element embedded in the first core; a second element embedded in the second core; a first pad and a second pad disposed on the first core layer and connected to the first element; a third pad and a fourth pad disposed on the second core layer and connected to the second element; and first connection layers interposed between one surface of the first core layer and one surface of the second core layer. The first pad and the third pad contact each other, and the first connection layers include at least one material of SiO2, SiN, and SiCN.