Embedded PCB Inductor Structure for Eddy Current Reduction
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Solution Overview
Problem
Existing inductor structures face challenges in miniaturization and cost-effective manufacturing due to limitations in integrating passive elements with high electrical characteristics into semiconductor packages, particularly with mechanical wire winding methods.
Innovation Solution
An inductor structure is developed with a carrier plate embedding a magnetic conductor and inductance coil, featuring patterned magnetic conductive layers and columnar inductance layers, allowing for precise control of inductance value and reduced manufacturing costs through a build-up wiring method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical wire winding method is used to achieve high inductance value and Q value, then electrical characteristics are improved, but miniaturization is limited and manufacturing complexity increases
Solution Approach 1:
The patent replaces the mechanical wire winding method with a printed circuit board (PCB) manufacturing process. The inductance coil is formed as a planar pattern on the PCB using standard PCB fabrication techniques (copper trace deposition, etching, and lamination), eliminating the need for mechanical winding operations while achieving the desired inductance value and electrical characteristics.
Solution Approach 2:
The patent transitions from a three-dimensional wire winding structure to a two-dimensional planar inductance coil pattern on the PCB. This dimensional change allows the inductor to be integrated directly into the PCB layer structure, enabling miniaturization and simplifying manufacturing while maintaining electrical performance.
2Reliability
If mechanical wire winding method is used to achieve high inductance value, then electrical characteristics are improved, but miniaturization capability deteriorates
Solution Approach 1:
The patent uses a planar inductance coil pattern fabricated on the PCB surface, converting the traditional volumetric wire winding into a two-dimensional layout. This allows the inductor to be flattened into the PCB plane, significantly reducing the overall height and enabling miniaturization while achieving the required inductance value through optimized trace geometry and magnetic core integration.
Solution Approach 2:
The patent embeds the inductance coil pattern and magnetic core directly within the PCB layer structure. The copper traces forming the coil are integrated into the PCB laminate, with the magnetic core positioned between PCB layers or embedded within the PCB structure, creating a nested configuration that minimizes external volume.
3Reliability
If passive elements are integrated into semiconductor packages as independent elements, then electrical characteristics are improved, but manufacturing difficulty increases
Solution Approach 1:
The patent merges the inductor fabrication process with the standard PCB manufacturing process. The inductance coil pattern is created using the same copper deposition and etching steps as the PCB circuit traces, and the magnetic core is integrated during PCB lamination. This consolidation eliminates separate inductor manufacturing and assembly steps, reducing manufacturing difficulty while maintaining electrical performance.
Solution Approach 2:
The PCB structure serves multiple functions simultaneously: it provides the mechanical support structure, the electrical circuit traces, the inductance coil pattern, and the mounting platform for the magnetic core. This multi-functionality eliminates the need for separate inductor components and simplifies the overall manufacturing process.
4Volume of moving object
If planar inductance coil pattern is used on PCB, then miniaturization is achieved and manufacturing is simplified, but eddy current effects increase
Solution Approach 1:
The patent segments the continuous copper trace of the inductance coil into isolated sections by removing copper material between adjacent turns of the coil pattern. This segmentation interrupts the eddy current paths that would otherwise form continuous loops in the copper traces, reducing eddy current losses while maintaining the inductive function of the coil pattern.
Solution Approach 2:
The patent applies different copper trace configurations to different regions of the inductance coil. The trace width, spacing, and pattern density are locally optimized to minimize eddy current effects in critical areas while maintaining inductance value. The segmented regions between coil turns have no copper connection, specifically targeting eddy current suppression at locations where it would be most harmful.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise control of inductance value, reduces manufacturing costs, and facilitates miniaturization by embedding the inductor within a carrier plate, improving electrical characteristics and reducing eddy current effects, thus meeting the demands of miniaturization and thinness in handheld and wearable electronic products.
Implementation Method 1
a magnetic conductor embedded in a coil of the inductance coil in the carrier plate, wherein the magnetic conductor comprises a magnetic material and at least one patterned magnetic conductive layer
Implementation Method 2
the patterned magnetic conductive layer extends to an outside of the inductance coil and has a plurality of openings corresponding to the plurality of columnar inductance layers of the inductance coil
Data Source
AI summary
Provided is an inductor structure and manufacturing method thereof, including forming an inductance coil in a semiconductor packaging carrier plate and disposing a patterned magnetic conductive layer in the inductance coil. Therefore, a patterned build-up wiring method is used to form a magnetic material in the carrier plate, thereby improving electrical characteristics of the inductor.