Embedded PCB Insulating Layers with Organotitanates
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic component embedded printed circuit boards face issues with mechanical characteristics and reliability due to thermal warpage and delamination caused by differences in thermal expansion coefficients between electronic components and insulating layers during high-temperature manufacturing processes.
Innovation Solution
Incorporating a coupling agent, such as organotitanates, into the insulating layers to enhance adhesion between organic and inorganic materials, specifically using a thermosetting resin composition with 0.1 to 3.0 wt % organotitanates based on the weight of inorganic fillers, to improve bonding performance and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If soldering and reflow processes are repeated in every manufacturing process, then electronic components can be mounted and connected, but high temperature heat causes warpage of the substrate and delamination at the bonding interface
Solution Approach 1:
The patent modifies the chemical composition parameters of the insulating layer by incorporating silane coupling agents and optimizing the resin system. This changes the thermal and mechanical properties of the insulating layer, enabling it to withstand repeated high-temperature soldering and reflow processes without causing substrate warpage or bonding interface delamination.
Solution Approach 2:
The patent creates a composite insulating layer by combining organic resin materials with inorganic fillers and silane coupling agents. This composite structure provides both the electrical insulation properties needed for PCB functionality and the thermal stability required to prevent warpage and delamination during repeated high-temperature manufacturing processes.
2Adaptability or versatility
If electronic components with different CTE are bonded to the substrate, then functional integration is achieved, but stress concentration occurs at the bonding interface during thermal cycling
Solution Approach 1:
The patent introduces silane coupling agents as intermediary substances at the bonding interface between electronic components and the substrate. These coupling agents create a transition layer that gradually bridges the CTE mismatch between dissimilar materials, reducing stress concentration and preventing delamination during thermal cycling while maintaining functional integration.
Solution Approach 2:
The patent modifies the chemical and physical parameters of the insulating layer by incorporating silane coupling agents and optimizing the resin composition. This creates an intermediate layer with graded properties that accommodates the CTE difference between electronic components and the substrate, reducing stress concentration during thermal expansion and contraction cycles.
3Volume of moving object
If the substrate area is reduced for miniaturization, then device size is reduced, but sufficient mounting area for electronic components cannot be secured
Solution Approach 1:
The patent employs thin-film insulating layers with enhanced mechanical properties achieved through silane coupling agent incorporation. These thin films provide sufficient electrical insulation and mechanical support while occupying minimal space, enabling compact PCB designs that maintain adequate functional mounting areas for electronic components despite overall size reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of organotitanates in the insulating layers significantly improves the shear strength and bonding reliability, reducing delamination and substrate defects, thereby enhancing the mechanical characteristics and reliability of the printed circuit boards.
Implementation Method 1
insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component
Data Source
AI summary
An electronic component embedded printed circuit board includes a core having a cavity; an electronic component inserted in the cavity; insulating layers laminated on top and bottom of the core and mixed with a coupling agent, which has functional groups respectively acting on an organic material and an inorganic material, to be bonded to an outer peripheral surface of the electronic component; and circuit patterns provided on the insulating layers.