Embedded Component PCB Fabrication Without Insulating Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for fabricating printed circuit boards with embedded components often leave an insulating layer beneath the components, limiting the reduction of board thickness and circuitry density.
Innovation Solution
A method involving a carrier plate with a plating metal layer, where an electronic component is disposed and laminated with a dielectric film, followed by removing the carrier plate to expose the metal layer, and patterning to form a circuit layer without any insulating layer beneath the component, thereby reducing thickness and increasing circuitry density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer is used beneath electronic components in conventional PCB fabrication, then the components can be properly supported and insulated, but the overall thickness of the circuit board increases and circuitry density is reduced
Solution Approach 1:
The patent removes the insulating layer from beneath the electronic component by using a carrier plate that is completely removed after component placement. The plating metal layer serves as both the support structure and the electrical connection, eliminating the need for underlying insulating material and thereby reducing overall board thickness.
Solution Approach 2:
The plating metal layer is designed to serve multiple functions simultaneously: it provides mechanical support for the component, ensures electrical connection, and acts as part of the circuit structure. This multi-functionality eliminates the need for separate insulating layers, achieving thinner PCB while maintaining reliability.
2Reliability
If an insulating layer is used beneath electronic components, then proper insulation is achieved, but the circuitry density is limited due to increased thickness
Solution Approach 1:
By extracting/removing the insulating layer from beneath the component, the patent enables tighter packing of circuitry and components. The carrier plate removal step is critical here, as it eliminates the thickness contribution of the insulating layer, allowing for higher circuitry density while maintaining insulation through alternative means (e.g., dielectric film above the component).
Solution Approach 2:
The patent shifts the insulation approach from the vertical dimension (beneath the component) to the horizontal dimension (around the component in the same plane). The dielectric film is placed above the component rather than beneath it, allowing insulation to be maintained while minimizing thickness and maximizing circuitry density.
3Ease of manufacture
If a carrier plate is used to hold the electronic component during fabrication, then the component can be properly positioned, but an insulating layer may remain beneath the component after fabrication
Solution Approach 1:
The carrier plate is designed to be completely removed from the final PCB structure. The plating metal layer is deposited directly onto the carrier plate, and after component placement and lamination, the carrier plate is removed entirely. This extraction process ensures no insulating layer remains beneath the component, achieving both ease of manufacture and manufacturing precision.
Solution Approach 2:
The plating metal layer is deposited onto the carrier plate in advance before component placement. This preliminary action ensures that when the carrier plate is removed, the plating layer remains as an integrated part of the PCB structure, eliminating the need for additional insulating layers and ensuring precise component positioning without residual insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a thinner printed circuit board with higher circuitry density by eliminating the insulating layer beneath the components, enhancing packaging efficiency.
Implementation Method 1
laminating a metal layer onto the plating metal layer and the carrier plate by a dielectric film
Implementation Method 2
providing a carrier plate having a plating metal layer plated thereon
Data Source
AI summary
A method for fabricating a component-embedded PCB includes: providing a carrier plate having a plating metal layer plated thereon; disposing an electronic component on the plating metal layer of the carrier plate; laminating a metal layer onto the plating metal layer having the electronic component disposed thereon and the carrier plate by a dielectric film; removing the carrier plate and exposing the plating metal layer; and patterning at least one of the metal layer and the plating metal layer to be a circuit layer.