Embedded PCB Structure for Low-Resistance Power Device Cooling
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Solution Overview
Problem
There is a demand for embedding semiconductor devices, such as power devices, in printed circuit boards to reduce power loss and improve heat dissipation, while existing technologies face challenges in minimizing parasitic resistance and ensuring efficient heat dissipation.
Innovation Solution
The solution involves embedding a semiconductor device, like a power device, in a cavity of a substrate with a metal block connected to it. This configuration includes a substrate with a cavity, a semiconductor device partially disposed in the cavity, a metal block connected to the semiconductor device, and an insulating layer covering and filling the cavity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a semiconductor device is embedded in a substrate cavity, then heat dissipation is improved, but parasitic resistance increases
Solution Approach 1:
The semiconductor device is nested within a cavity formed in the substrate, with the metal block positioned beneath the device to provide both mechanical support and electrical connection. This nesting approach allows the device to be embedded while maintaining low parasitic resistance through the direct metal block connection, resolving the contradiction between heat dissipation improvement and parasitic resistance reduction.
Solution Approach 2:
The metal block serves as an intermediary element between the substrate and the semiconductor device, providing both mechanical support and electrical connection. This intermediary structure enables the device to be embedded in the substrate cavity while maintaining low parasitic resistance and improving heat dissipation through the metal block's thermal and electrical conductivity.
2Loss of energy
If a metal block is connected to the semiconductor device, then parasitic resistance is reduced, but device complexity increases
Solution Approach 1:
The metal block performs multiple functions simultaneously: it provides mechanical support for the semiconductor device, establishes electrical connection to reduce parasitic resistance, and facilitates heat dissipation. By combining these functions into a single component, the overall device complexity is minimized while achieving the desired performance improvements.
Solution Approach 2:
The metal block merges the functions of mechanical support, electrical connection, and thermal management into a single integrated component. This merging approach reduces the number of separate elements needed in the embedded device structure, thereby reducing device complexity while maintaining low parasitic resistance.
3Loss of energy
If the semiconductor device is embedded in the substrate, then power loss is reduced, but manufacturing complexity increases
Solution Approach 1:
The cavity is pre-formed in the substrate before the semiconductor device is installed, and the metal block is positioned in advance to provide both mechanical support and electrical connection. This preliminary preparation of the embedding structure simplifies the overall manufacturing process by organizing steps in a logical sequence, reducing power loss through proper device placement while managing manufacturing complexity.
Solution Approach 2:
The manufacturing process is segmented into distinct steps: cavity formation in the substrate, metal block positioning, semiconductor device installation, and insulating layer application. This segmentation of the manufacturing process into manageable stages reduces overall manufacturing complexity while enabling the embedded device structure that minimizes power loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces power loss by minimizing parasitic resistance and enhances heat dissipation by allowing for smooth heat dissipation from the power device, thereby improving the overall efficiency and performance of the printed circuit board.
Implementation Method 1
a metal block of which at least a portion is disposed in the cavity, the metal block being connected to the semiconductor device
Implementation Method 2
a first insulating layer covering at least a portion of each of the substrate, the semiconductor device, and the metal block
Data Source
AI summary
A printed circuit board includes: a substrate having a cavity; a semiconductor device at least partially disposed in the cavity, with a first metal pad and a gate being disposed on a lower side of the semiconductor device and a second metal pad being disposed on an upper side of the semiconductor device; a metal block at least partially disposed in the cavity, the metal block being connected to the second metal pad; and a first insulating layer covering at least a portion of each of the substrate, the semiconductor device, and the metal block, and filling at least a portion of the cavity.