Embedded PCB Power Module Layout for Higher Converter Density
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Solution Overview
Problem
In applications where space is limited, such as automotive and computer servers, traditional power modules face challenges due to the board space required by output capacitors, which reduces the number of power converters and limits power delivery.
Innovation Solution
The power module design incorporates a printed circuit board (PCB) with embedded output capacitors and inductors, utilizing a plurality of parallel discrete capacitors within a substrate layer to conserve space and integrate components like monolithic IC switch blocks and output inductors, allowing for a low-profile configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional power modules use discrete output capacitors mounted on the PCB surface, then voltage regulation is achieved, but board space is consumed and power converter density is reduced
Solution Approach 1:
The patent merges the output capacitor function with the PCB substrate by embedding capacitors within the substrate layers. Multiple capacitor elements are integrated into the PCB structure, eliminating the need for separate discrete capacitor components mounted on the board surface, thereby conserving board space while maintaining voltage regulation functionality
Solution Approach 2:
The patent transitions from two-dimensional surface mounting of discrete capacitors to three-dimensional embedding within the PCB substrate layers. Capacitors are positioned within the thickness of the substrate rather than on the surface, utilizing the vertical dimension to reduce the footprint on the board while preserving the electrical function
2Power
If more power converters are added to increase power delivery, then power output is improved, but board space requirements increase
Solution Approach 1:
By embedding output capacitors within the PCB substrate, the patent eliminates the space occupied by discrete capacitor components. This freed board space can then be utilized to accommodate additional power converter phases, enabling higher power delivery capability without increasing the overall board footprint
Solution Approach 2:
The patent divides the capacitor function into multiple distributed capacitor elements embedded within different substrate layers. This segmentation allows for optimized placement around power converter phases, enabling better space utilization and supporting higher density power converter configurations
Data Source
AI summary
A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes.