Embedded PCB Module Positioning via Recess Insertion
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Solution Overview
Problem
Existing methods for producing printed circuit boards with embedded electronic components are complex and require gluing, soldering, or heating processes, which increase production effort and complexity.
Innovation Solution
A method where a prefabricated printed circuit board module with an embedded electronic component is used, featuring electrically conductive and insulating layers. This module is inserted into a recess in a positioning layer, surrounded by additional insulating layers, and then pressed with a conductive layer on top, eliminating the need for gluing or heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic components are embedded in printed circuit boards using conventional methods (gluing, soldering, heating), then the components can be securely positioned and electrically connected, but the production process becomes complex and requires multiple additional steps
Solution Approach 1:
The patent applies preliminary action by pre-structuring the printed circuit board with integrated recesses and positioning elements before component placement. The recesses are formed directly in the PCB layers during manufacturing, and positioning protrusions are built into the board structure, eliminating the need for separate gluing or heating processes. This allows components to be securely positioned through simple mechanical insertion into the pre-prepared recesses.
2Productivity
If electronic components are embedded in printed circuit boards to increase component density, then more components can be arranged on the board, but the production effort and complexity increase
Solution Approach 1:
The patent merges the component embedding process with the standard PCB manufacturing process. The recesses for embedding components are formed as part of the layer construction process, and the positioning structures are integrated into the PCB layers themselves. This consolidation allows component embedding to be performed using standard PCB manufacturing equipment and procedures, significantly reducing the additional production effort required compared to separate embedding processes.
3Strength
If conventional embedding methods are used requiring support layers and heating, then components can be fixed to the board, but the manufacturing steps become numerous and time-consuming
Solution Approach 1:
The patent extracts and eliminates the unnecessary support layer and heating steps from the conventional embedding process. Instead of using a separate support layer that requires heating to activate adhesive, the invention uses recesses formed directly in the PCB structure with integrated positioning elements. Components are secured through mechanical interference fit in the recesses, achieving strong bonding without the time-consuming heating and adhesive application steps.
Data Source
AI summary
A method for producing a printed circuit board having at least one embedded electronic component, in which a support layer and a positioning layer having a recess somewhat larger than the corresponding base area of the printed circuit board module are provide, the positioning layer is placed on the support layer and the printed circuit board module inserted into the recess in the positioning layer. The printed circuit board module is positioned without soldering or gluing, and at least one electrically insulating layer placed on the printed circuit board module and the positioning layer surrounding the printed circuit board module. An electrically conductive layer is placed on the at least one electrically insulating layer covering the printed circuit board module, and the layer sequence is pressed. The bores in the pressed layer sequence are metallized.