Embedded Circuit Board Assembly With Localized Thermal Dielectrics
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Solution Overview
Problem
The challenge of thermal management in miniaturized power converters is exacerbated by the dissimilar mechanical properties of high thermal conductivity materials, which are typically integrated externally, leading to space constraints and reduced reliability in applications like guided projectiles.
Innovation Solution
A circuit board assembly design incorporating a circuit component die enclosed laterally by dielectric layers with varying thermal conductivities, where a high thermal conductivity dielectric material forms planar surfaces with conductive layers, and vias are filled with conductive material to create a sandwich structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high thermal conductivity materials are integrated into the PCB, then thermal performance is improved, but mechanical compatibility deteriorates due to dissimilar mechanical properties
Solution Approach 1:
The dielectric structure is segmented into multiple layers with different thermal conductivities. High thermal conductivity dielectric layers are positioned adjacent to the power device for effective heat transfer, while bulk dielectric material with lower thermal conductivity forms the majority of the PCB structure. This segmentation allows thermal management functionality to be localized where needed without requiring the entire structure to use high thermal conductivity materials, thus maintaining mechanical compatibility.
Solution Approach 2:
The patent applies local quality by providing high thermal conductivity dielectric material specifically in the regions where thermal management is critical (adjacent to the power device), while using conventional bulk dielectric material in other regions. This localized approach ensures that thermal performance is optimized at the heat source without compromising the overall mechanical stability of the PCB assembly.
2Adaptability or versatility
If multiple PCBs are used to include all desired devices, then device integration is improved, but reliability deteriorates
Solution Approach 1:
The patent merges multiple functional layers and device types into a single integrated PCB structure. Power devices, signal processing components, and dielectric layers are combined in a multi-layer configuration, eliminating the need for multiple separate PCBs. This integration reduces the number of inter-PCB connections and interfaces, thereby improving overall system reliability while maintaining the ability to include all desired devices.
3Temperature
If high thermal conductivity materials are used, then heat dissipation is improved, but ease of manufacture deteriorates
Solution Approach 1:
The manufacturing process is segmented into stages where high thermal conductivity dielectric layers are integrated as specific layers within the PCB stack-up, rather than requiring the entire PCB to be manufactured from difficult-to-process high thermal conductivity material. This allows standard PCB manufacturing techniques to be used for the bulk structure while incorporating high thermal conductivity layers through conventional lamination and bonding processes.
Solution Approach 2:
The patent employs composite dielectric structures combining high thermal conductivity dielectric material with conventional bulk dielectric material. This composite approach enables the use of high thermal conductivity materials in controlled quantities and specific locations, making the overall manufacturing process more feasible while still achieving effective heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal performance and miniaturization by allowing embedded power devices within a heterogeneous substrate, reducing thermal resistance and enabling high-power density applications without air gaps or structural issues.
Implementation Method 1
The bulk dielectric material can have a lower glass transition temperature than the first dielectric material... heating the sandwich structure to a temperature at or above the glass transition temperature of the bulk dielectric material but below the glass transition temperature of the first dielectric layer and the second dielectric layer to flow the bulk dielectric material
Implementation Method 2
a first dielectric layer disposed on a first side of the circuit component die made of a first dielectric material having a high thermal conductivity... This design enhances thermal performance and miniaturization by allowing embedded power devices within a heterogeneous substrate, reducing thermal resistance
Data Source
AI summary
A circuit board assembly can include a circuit component die, a first dielectric layer disposed on a first side of the circuit component die made of a first dielectric material having a high thermal conductivity, a second dielectric layer disposed on a second side of the circuit component die made of the first dielectric material, and a bulk dielectric material having a lower thermal conductivity than the first dielectric material. The bulk dielectric material can have a lower glass transition temperature than the first dielectric material and being heterogeneous to the first dielectric material. The bulk dielectric material can be in flowed contact with lateral sides of the circuit component die, the first dielectric layer, and the second dielectric layer to laterally enclose the circuit component die, the first dielectric layer, and the second dielectric layer.