Embedded PCB Warpage Control via Resin Thickness Ratio
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Solution Overview
Problem
Conventional semiconductor chip embedded printed circuit boards experience warpage due to unbalanced thermal expansion coefficients of materials, making mass production difficult and subsequent processes challenging.
Innovation Solution
The electronic component-embedded printed circuit board features a base plate with an insulating resin layer and circuit layers, where the resin layer's thickness is 1.3-3 times that of the electronic component, and the circuit layers' thickness ratio is optimized to minimize warpage, with an adhesion layer interposed between the component and lower circuit layer to maintain structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional manufacturing methods are used to embed semiconductor chips in printed circuit boards, then the board achieves high functionality and miniaturization, but the board experiences warpage due to unbalanced thermal expansion coefficients
Solution Approach 1:
The patent applies parameter changes by precisely controlling the thickness of the insulating resin layer (set to 1.3-3 times the electronic component thickness) and the thickness ratios of circuit layers (upper circuit layer 1.1-2.6 times the lower circuit layer). These parameter adjustments balance the thermal expansion coefficients of different materials, resolving the warpage issue while maintaining high functionality.
Solution Approach 2:
The patent uses composite materials by combining the insulating resin layer, multiple circuit layers, adhesion layer, and electronic component into a multi-layer structure. This composite construction allows for balanced thermal expansion properties across different materials, preventing warpage while achieving miniaturization and high functionality.
2Stability of the object's composition
If the insulating resin layer thickness is increased to balance thermal expansion, then warpage is reduced, but the overall board thickness increases
Solution Approach 1:
The patent optimizes the insulating resin layer thickness to be 1.3-3 times the electronic component thickness, which is the minimum required to achieve warpage reduction. This precise parameter control balances thermal expansion without excessive thickness increase, resolving the contradiction between stability and compactness.
3Adaptability or versatility
If multiple circuit layers are added to achieve high functionality, then the board becomes more versatile, but the thermal expansion balance is disrupted causing warpage
Solution Approach 1:
The patent maintains thermal expansion balance in multi-layer configurations by setting the upper circuit layer thickness to 1.1-2.6 times the lower circuit layer thickness. This parameter control allows multiple functional layers while preventing warpage, resolving the contradiction between versatility and stability.
Solution Approach 2:
The patent constructs a composite multi-layer structure where the insulating resin layer (3-22 times thicker than the upper circuit layer) acts as a thermal expansion buffer between the upper and lower circuit layers. This composite design enables multi-functionality while maintaining overall thermal balance.
4Ease of manufacture
If the printed circuit board is warped, then subsequent manufacturing processes cannot be performed, but rework or manual processing increases production time and cost
Solution Approach 1:
The patent applies preliminary anti-action by designing the insulating resin layer thickness (1.3-3 times the electronic component thickness) to preemptively counteract thermal expansion forces before manufacturing processes occur. This prevents warpage from developing during subsequent circuit forming and laser processing, ensuring mass production efficiency without rework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces warpage, allowing for reliable mass production by maintaining the balance of thermal expansion coefficients and ensuring the electrical properties of the printed circuit board are preserved.
Implementation Method 1
the insulating resin layer has a thickness 1.3-3 times greater than that of the electronic component... maintain the balance of thermal expansion coefficients
Data Source
AI summary
Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.