Embedded PCB Laminate Structure for Warpage-Stable Thin Components
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Solution Overview
Problem
Embedding thin passive devices in the core layer of a printed circuit board is challenging due to thickness mismatch and warpage issues, particularly in server products with thick core layers, making it difficult to fill empty spaces with build-up material.
Innovation Solution
A printed circuit board design that includes a first insulating layer with a through-portion, a component laminate with an electronic component and insulating material on its back surface, and a second insulating layer covering the first insulating layer and component laminate, where the insulating material has a smaller thermal expansion coefficient mismatch with the silicon body, allowing for easier embedding and process simplification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a thick core insulating layer is used to control warpage in server products, then warpage control is improved, but the ability to embed thin electronic components is worsened due to thickness mismatch
Solution Approach 1:
The insulating layer is divided into multiple segments: a thick core insulating layer for warpage control and thinner build-up insulating layers for embedding thin components. This segmentation allows each layer to serve its specific function optimally without compromising the other.
Solution Approach 2:
Different regions of the insulating structure have different thicknesses tailored to local requirements. The core layer is thick for warpage control, while the build-up layers are thinner to match the thickness of embedded components, ensuring proper embedding precision in each region.
2Productivity
If thin electronic components are embedded in a thick core layer, then component density is improved, but the difficulty of filling empty space with build-up material increases
Solution Approach 1:
The thickness parameter of the insulating layers is changed dynamically. Build-up insulating layers are designed with specific thickness values that match the dimensions of embedded components, transforming the manufacturing process from filling random empty space to precisely matching dimensional parameters.
Solution Approach 2:
Build-up insulating layers act as intermediaries between the thick core layer and the thin electronic components. These intermediary layers facilitate the embedding process by providing a thickness-matched interface that simplifies material filling and reduces manufacturing difficulty.
3Ease of manufacture
If multiple insulating layers are added to match component thickness, then embedding ease is improved, but device complexity increases
Solution Approach 1:
The build-up insulating layers serve multiple functions simultaneously: they match the thickness of embedded components for easy embedding, provide mechanical support, and maintain electrical insulation. This multi-functionality reduces the need for additional specialized layers, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective embedding of thin electronic components, improves warpage stability, and reduces costs by simplifying the process while maintaining power integrity.
Implementation Method 1
A difference in coefficients of thermal expansion between the silicon body and the insulating material may be smaller than at least one of a difference in coefficients of thermal expansion between the silicon body and the core insulating layer and a difference in coefficients of thermal expansion between the silicon body and the build-up insulating layer.
Data Source
AI summary
The present disclosure relates to a printed circuit board, the printed circuit board including: a component laminate including an electronic component having a first surface on which a connection pad is disposed and a second surface, opposite to the first surface, and an insulating material disposed on the second surface of the electronic component, wherein at least a portion of the component laminate is disposed within the through-portion; and a second insulating layer covering at least a portion of each of the first insulating layer and the component laminate, and disposed in at least a portion of the through-portion. The insulating material includes an organic insulating material.