Embedded PCB Winding Power Converter Footprint Reduction
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Solution Overview
Problem
The shrinking footprint in electronic devices poses a challenge for power converters, as they require space for voltage conversion and current type changes, leading to increased complexity and size.
Innovation Solution
Incorporating a winding structure within the conductive layers of a printed circuit board, combined with a ferromagnetic substrate and power integrated circuit, allows for compact power conversion devices that reduce footprint by embedding the winding structure within the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the winding structure is placed in a separate printed circuit board or another location, then the power conversion device can be assembled, but the footprint of the power conversion device increases
Solution Approach 1:
The patent merges the winding structure with the system printed circuit board by embedding the winding structure within conductive layers of the PCB. This integration eliminates the need for separate winding components or additional PCBs, thereby reducing the overall footprint of the power conversion device while maintaining functional complexity through layered integration
2Area of stationary object
If the winding structure is embedded within the printed circuit board, then the footprint of the power conversion device is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent resolves the manufacturing complexity issue by transitioning the winding structure from a planar arrangement to a three-dimensional embedded configuration within the PCB layers. The winding structure is formed within embedded conductive layers below the ferromagnetic substrate, utilizing vertical space rather than horizontal expansion, which enables compact integration while maintaining manufacturability through standard PCB layering techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient power conversion while minimizing space, allowing for smaller form factors in electronic devices by integrating the winding structure within the printed circuit board, thus addressing the space constraints and improving device compactness.
Implementation Method 1
a ferromagnetic substrate disposed below the power IC
Implementation Method 2
The winding structure can be formed within the embedded conductive layers of the printed circuit board below the ferromagnetic substrate and be in electrical communication with the power IC
Data Source
AI summary
A power conversion device includes a winding portion and a core portion. The winding portion can be embedded within a plurality of layers of a system printed circuit board. The core portion can be located within one or more elements of the power conversion device that are separate from the system printed circuit board.