Embedded Peltier Micro-Vias for 3D IC Cooling

Solution Overview

Problem

Three-dimensional integrated circuits experience undesirable heat buildup due to inefficient cooling techniques, which can lead to device failure and performance issues, particularly in semiconductor packages.

Innovation Solution

A semiconductor device package is designed with thermoelectric couples embedded in a semiconductor substrate, featuring N-type and P-type thermoelectric pillars in trenches, a thermally conducting isolation layer, and a series connection layer for efficient heat transfer to a heat sink using the thermoelectric effect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling techniques are used, then cooling function is provided, but heat transfer efficiency is insufficient leading to heat buildup

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoiddevice reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent replaces conventional mechanical cooling systems (heat sinks, fans, pumps) with a solid-state thermoelectric cooling system. Thermoelectric couples embedded in the substrate use electrical current to directly pump heat from the device side to the handle side, eliminating moving parts and achieving superior heat transfer efficiency while improving device reliability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The thermoelectric couples are embedded directly within the substrate structure itself, with trenches formed in the substrate containing the thermoelectric pillars. This nested integration allows the cooling function to be built into the substrate, achieving efficient heat transfer without requiring separate external cooling apparatus.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Temperature

If thermoelectric couples are embedded in substrate, then heat transfer efficiency is improved, but device complexity increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidsubstrate structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The thermoelectric couples are embedded directly within the substrate structure itself, with trenches formed in the substrate containing the thermoelectric pillars. This nested integration allows the cooling function to be built into the substrate, achieving efficient heat transfer without requiring separate external cooling apparatus.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent combines the cooling function with the substrate structure by integrating thermoelectric couples directly into the substrate. The substrate serves dual purposes: as the mechanical support for devices and as the heat transfer medium, merging structural and thermal management functions into a single component.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If external cooling apparatus is used, then cooling function is provided, but device portability and integration are reduced

Engineering Contradiction:

Improvecooling functionVSAvoiddevice integration

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The thermoelectric couples are embedded directly within the substrate structure itself, with trenches formed in the substrate containing the thermoelectric pillars. This nested integration allows the cooling function to be built into the substrate, achieving efficient heat transfer without requiring separate external cooling apparatus.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The substrate serves multiple functions: it provides mechanical support for the devices, acts as the heat transfer medium through embedded thermoelectric couples, and serves as the structural base for the entire device. This multi-functionality eliminates the need for separate cooling apparatus and improves device integration.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively transfers heat away from the device side of the substrate to the heat sink, enhancing cooling efficiency without requiring moving components or external cooling apparatus, thus addressing the heat buildup issue in three-dimensional ICs.

Implementation Method 1

transfers heat away from the device side of the substrate to the heat sink using the thermoelectric couples

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS9941458B2Integrated circuit cooling using embedded peltier micro-vias in substrate

Publication Date: 2018.04.10 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

A semiconductor device package and method for manufacturing the same, includes a semiconductor substrate including a plurality of embedded thermoelectric couples. The embedded thermoelectric couples can be in trenches and extend partially into the substrate from the handle side of the substrate. An n-type pillar and a p-type pillar are electrically connected using a conducting contact plate to form each of the partially embedded thermoelectric couples. A series connection layer electrically connects the plurality of thermoelectric couples on the handle side. A power source provides electrical current to the series connection layer allowing current to flow through the plurality of the series connected thermoelectric couples. A heat sink is positioned adjacent to the connected thermoelectric couples for transferring heat away from the device side to the heat sink using the thermoelectric couples.