Embedded Photonics in Glass Substrate Core
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Solution Overview
Problem
The increasing off-package input/output bandwidth and data rates in integrated circuit packaging face challenges with reduced electrical I/O circuit reach and slowed energy efficiency improvements, leading to a power wall, which photonics integrated circuits (PICs) aim to address through enhanced power efficiency and bandwidth.
Innovation Solution
Embedding PICs within a glass core of the package substrate, utilizing a glass core with build-up layers and optical connections like waveguides and microlenses, and pluggable fiber array units to improve optical coupling and reduce z-height, enabling efficient data transfer and power management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrical I/O circuits are used to increase off-package bandwidth, then data transfer capability is improved, but power consumption increases and reach is reduced
Solution Approach 1:
The patent replaces electrical I/O circuits with photonic integrated circuits that use optical signals instead of electrical signals for data transmission. This substitution of the transmission mechanism fundamentally changes the energy efficiency characteristics, enabling high bandwidth while reducing power consumption and extending reach beyond the limitations of electrical circuits.
Solution Approach 2:
The patent changes the fundamental transmission parameter from electrical signals to optical signals. This parameter change enables simultaneous improvement in bandwidth, power efficiency, and reach by operating in the optical domain where photons instead of electrons carry the data signals through the package substrate.
2Ease of manufacture
If PICs are placed on top of or inside traditional organic package substrate, then integration is achieved, but optical coupling efficiency is reduced and z-height increases
Solution Approach 1:
The patent merges the PIC embedding location with the glass core layer of the package substrate, placing the PICs directly within the glass core rather than on top of or in separate cavities within the organic substrate. This merging of locations enables direct optical coupling through the glass material while maintaining low z-height and high manufacturing precision.
Solution Approach 2:
The glass core layer serves as an intermediary medium that enables direct optical coupling between PICs embedded within it and external optical fibers or waveguides. The glass material provides the necessary optical properties for efficient light transmission while allowing precise positioning and coupling of the embedded PICs.
3Measurement precision
If traditional pigtail FAU with v-grooves is used for optical connection, then fiber alignment is achieved, but z-height is increased and pluggability is lost
Solution Approach 1:
The patent extracts the v-groove alignment structure from the traditional pigtail FAU design and replaces it with a pluggable FAU that achieves fiber alignment through alternative means. This extraction of the alignment mechanism from the rigid pigtail structure enables reduced z-height while maintaining precise fiber alignment and adding pluggability functionality.
Solution Approach 2:
The patent transitions from a static, fixed pigtail FAU with v-grooves to a dynamic pluggable FAU that can be inserted and removed. This dynamic design maintains fiber alignment precision through the plugging action while significantly reducing the z-height requirement and enabling reconfigurable optical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances optical coupling, reduces power consumption, and increases bandwidth while maintaining system compatibility, addressing the limitations of traditional electrical I/O circuits by integrating photonics within the package substrate.
Implementation Method 1
The optical path may include a waveguide formed in the glass core layer
Implementation Method 2
The optical path may include a microlens
Data Source
AI summary
In one embodiment, an integrated circuit package includes a package substrate comprising a glass core layer, an optical path at least partially in the glass core layer, and a photonics integrated circuit (PIC) at least partially embedded in the glass core layer and in optical connection with the optical path. The optical path may include a waveguide in the glass core layer and/or a microlens. The integrated circuit package may also include an electronic integrated circuit (EIC) in electrical connection with the PIC, and a processor in electrical connection with the EIC.