Embedded Photonic Integrated Circuit Substrate Warpage Mitigation
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Solution Overview
Problem
Conventional on-package optics modules and fiber optic couplers face integration challenges with advanced packaging, particularly in 2.xD and 3D integrated circuits, and suffer from package warpage and reliability issues.
Innovation Solution
Integration of photonic and electronic integrated circuits within substrates or interposers, with fiber optic couplers embedded or coupled to the substrate, allowing optical signal transmission and reception, and using routing layers for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If on-package optics modules are placed in a multi-chip module configuration at the edge of a semiconductor package, then integration with advanced packaging is difficult, but this arrangement allows for separate module placement
Solution Approach 1:
The patent merges the on-package optics module with the semiconductor package substrate by embedding the optics module directly into the substrate. This integration allows the optics module to be co-located with electronic circuits rather than placed separately at the package edge, enabling better adaptation to advanced packaging technologies like 2.5D and 3D IC while reducing overall packaging complexity through unified structure design.
2Ease of manufacture
If conventional on-package optics modules are used, then module placement is simplified, but package warpage and reliability issues occur
Solution Approach 1:
The patent applies local quality by creating a specialized embedding structure within the substrate that provides localized mechanical support and stress distribution. The optics module is embedded in a dedicated region with optimized material composition and structural characteristics, allowing the local area to accommodate the module while maintaining overall package flatness and reliability, thus preventing warpage issues.
3Reliability
If photonic integrated circuits are embedded within substrates or interposers, then integration capabilities are enhanced and warpage issues are mitigated, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary action by pre-forming embedding structures and preparing substrate regions before inserting the photonic integrated circuits. The substrate is prepared with designated embedding areas, routing layers are pre-configured, and mechanical support structures are established in advance. This preliminary preparation simplifies the subsequent integration process and reduces manufacturing complexity despite the enhanced reliability benefits of embedded PICs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances integration capabilities, mitigates warpage issues, and improves signal integrity by embedding photonic integrated circuits within substrates or interposers, facilitating reliable operation in advanced packaging configurations.
Implementation Method 1
the PIC is configured to transmit or receive an optical signal via the fiber optic coupler
Data Source
AI summary
An apparatus includes a substrate that includes one or more routing layers, and an optical module coupled to the substrate. The optical module includes a photonic integrated circuit (PIC) and electronic integrated circuit (EIC), wherein the photonic integrated circuit is at least partially embedded within the substrate. The apparatus further includes a fiber optic coupler coupled to at least one of the substrate or PIC, wherein the PIC is configured to transmit or receive an optical signal via the fiber optic coupler.