Embedded Component Pin Structure for Reliable PCB Solder Joints
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Solution Overview
Problem
Existing embedded chip package substrates using land grid array (LGA) suffer from poor soldering reliability due to surface contact, leading to potential solder joint failures under mechanical stress and temperature changes.
Innovation Solution
The implementation of pins with varying dimensions and shapes, including grooves and inclined surfaces, to enhance soldering areas and interlocking forces, combined with non-remelting materials, ensures robust connections between the electronic component package body and circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If land grid array (LGA) is used for surface-mount packaging, then the packaged component can be fastened to the circuit board, but soldering reliability is poor and solder joints are easily broken under mechanical stress
Solution Approach 1:
The patent transitions from traditional surface-mount LGA packaging to a pin-based three-dimensional packaging structure. Pins extend vertically from the substrate, creating a three-dimensional connection architecture that enables deeper penetration and stronger mechanical interlocking with the circuit board, thereby resolving the weakness of surface-contact soldering
Solution Approach 2:
The pin structure is divided into multiple segments including a first part embedded in the substrate, a second part protruding from the substrate, and optionally a third part extending further. This segmentation allows each part to perform specific functions: electrical connection, mechanical support, and enhanced soldering attachment, improving overall reliability
2Reliability
If pins with grooves and inclined surfaces are implemented, then soldering area and interlocking forces are enhanced, but device complexity increases
Solution Approach 1:
The pin structure incorporates localized features such as grooves on the side surface of the second part and inclined surfaces at specific locations. These local modifications concentrate stress distribution, enhance soldering area at critical points, and provide mechanical interlocking without requiring complete redesign of the entire pin structure, thus balancing complexity and performance
Solution Approach 2:
The grooves and inclined surfaces are integrated into the pin structure as nested geometric features. The grooves are formed within the pin body, and inclined surfaces are incorporated as part of the pin's external geometry, creating a compact multi-functional structure that enhances soldering capability without proportionally increasing overall device complexity
Data Source
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AI summary
Embodiments of this application disclose an electronic component package body, an electronic component assembly structure, and an electronic device. The electronic component assembly structure includes: an electronic component package body, where the electronic component package body includes a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin includes a first part and a second part connected to the first part, the first part is embedded in the substrate, and the second part protrudes from the substrate; the second part includes a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate; a circuit board, where the electronic component package body is mounted on the circuit board, and the circuit board is electrically connected to the electronic component; and a solder joint, where the solder joint is connected between the pin and the circuit board and surrounds the bottom surface and the side surface of the second part. In the electronic component assembly structure provided in this application, reliability of soldering between the electronic component package body and the circuit board is relatively high.